Industry News Archive Provided by SEMI

Industry News Archives 2014

SEMI provides this archive of news and information from industry news sources as a resource. Due to the nature of dated material on the internet, SEMI does not guarantee that links are maintained by the news provider.

Applied Materials testing superconducting fault current limiter technology
(Pv Tech, Apr 15)

SEMI Reports 2013 Semiconductor Photomask Sales of $3.1 Billion
(EMS Now, Apr 15)

SEMI Reports 2013 Semiconductor Photomask Sales of $3.1 Billion
(Press Release Point, Apr 14)

Favorite Forecast Fallacies
(Semiconductor Engineering, Apr 14)

The Sustainable Manufacturing Imperative
(Semiconductor Manufacturing & Design, Apr 11)

LED front-end equipment market leaders continue to dominate
(EE Times Europe, Apr 10)

Developing phosphor-free white light from nanopyramid LEDs
(Semiconductor Today, Apr 10)

Intel Honors 18 Companies with Preferred Quality Supplier and Achievement Awards
(Investing & Stock Research - Businessweek, Apr 10)

SEMI Releases 4th Quarter 2013 Worldwide Photovoltaic Equipment Market Statistics Report
(TMCnet.com, Apr 10)

SEMICON Singapore 2014 Gears Up for the Future with a Focus on Advanced Technology Developments
(Semiconductor Packaging News, Apr 10)

Pain Management
(Semiconductor Engineering, Apr 10)

SEMI announces Innovation Village at SEMICON Europa 2014
(Solid State Technology (Blog), Apr 09)

SEMI releases fourth quarter 2013 worldwide photovoltaic equipent market statistics report
(Solid State Technology (Blog), Apr 09)

Japan's chipmaking equipment vendors fall in 2013 ranking
(EE Times Europe Analog, Apr 09)

Innovation Village at SEMICON Europa 2014: Come Innovate with Us
(TMCnet.com, Apr 09)

SUSS MicroTec Publishes its First Report on Sustainability
(TMCnet.com, Apr 09)

Interesting Moves in the PE Industry
(Printed Electronics Now, Apr 08)

Samsung claims breakthrough in graphene commercialisation
(Computerworld Malaysia, Apr 08)

Innovation Village at SEMICON Europa 2014: Come Innovate with Us
(Press Release Point, Apr 08)

SEMI Reports 2013 Global Semiconductor Materials Sales of $43.5 Billion
(TMCnet.com, Apr 08) 

2013: A year in review
(Solid State Technology (Blog), Apr 04)

The Week In Review: Manufacturing
(Semiconductor Engineering, Apr 04)

A Chinese City Goes After Silicon Valley
(Silicon Valley Business Journal, Apr 03)

Perovskite, a New Meta Material, Turns Light Into Power, Lasers
(Electronic Engineering Times, Apr 03)

Edwards opening US service center
(Semiconductor Today, Apr 03)

Critical milestone for Global 450mm Consortium announced
(Nanowerk, Apr 02)

Smaller microchips that keep their cool
(Phys.Org, Apr 02)

IC Insights Shows Big Changes to 2013 Top 20 Semi Supplier Ranking
(EMS Now, Apr 02)

MEMS, Magnetics Set to Lead Sensor Market Rebound in 2014
(Electronic Engineering Times, Apr 01)

FD-SOI: Back to Basics For Best Cost, Energy Efficiency and Performance
(Semiconductor Manufacturing & Design, Mar 31)

Tech Talk: Multipatterning, Take Two
(Semiconductor Engineering, Mar 31)

MEMS – Enter with Care
(Semiconductor Manufacturing & Design, Mar 27)

Samsung leads chip capex ranking
(EE Times Europe Analog, Mar 27)

How Much Will That Chip Cost?
(Semiconductor Engineering, Mar 27)

Samsung, Intel, TSMC to Dominate Semicon Capex in 2014
(PCB007 IConnect007, Mar 26)

Mixing silicon with other materials improves the diversity of nanoscale electronic devices
(Phys.Org, Mar 26)

UK should look to France for tech policy
(Electronics Weekly, Mar 26)

Blog Review: March 26
(Semiconductor Engineering, Mar 26)

China to Blow $10B a Year on Chips
(Electronic Engineering Times, Mar 25)

IC market for personal computing systems to jump 6% in 2014, says IC Insights
(Digitimes, Mar 25)

Scientists develop 3D SEM metrology for 10nm structures
(Phys.Org, Mar 24)

EUV Reaches A Crossroads
(Semiconductor Engineering, Mar 20)

Advanced Lithography: Moore’s Law Moves On
 (Semiconductor Engineering, Mar 20)

450mm Standards Update
 (Semiconductor Engineering, Mar 20)

SMIC CEO is awarded SEMI Outstanding EHS Achievement Award
(Solid State Technology (Blog), Mar 19)

SEMICON Singapore 2014 to Highlight IoT
 (PCB007 IConnect007, Mar 19)

Silicon Innovation Forum to Expand in 2014
 (EMS Now, Mar 18)

Japan rebalances its solar market
(PV Magazine, Mar 17)

AIXTRON puts demo cluster for OLED production processes into operation
(TMCnet.com, Mar 17)

Advantest launches semiconductor industry's highest density power supply with greater voltage range
(Display Plus, Mar 17)

STATS ChipPAC introduces breakthrough manufacturing method for wafer level packaging
(Display Plus, Mar 17)

An exotic phase to manipulate spin
(Nanowerk, Mar 14)

Silicon Innovation Forum to expand in 2014
(Solid State Technology (Blog), Mar 13)

Fab productivity and process technologies addressed at upcoming semiconductor manufacturing conference
(Solid State Technology (Blog), Mar 12)

SEMI reports 2013 global semiconductor equipment sales of $31.6 billion
(Solid State Technology (Blog), Mar 12)

SEMICON Russia Unveils Microelectronics Market Opportunities
(PCB007 IConnect007, Mar 12)

20 Freescale Semiconductor employees missing in Malaysia Airlines Flight
(Electronic Products Magazine, Mar 10)

Wafer Fab ancillaries in Guj will create jobs for 10,000 engineers [DNA : Daily News & Analysis (India)]
(TMCnet.com, Mar 06)

Fab Equipment Spending to Grow 30% in 2014
(PCB007 IConnect007, Mar 06)

Fab equipment spending to rise 20-30% in 2014, says SEMI
(Digitimes, Mar 06)

State of EUVL – Challenges of HVM Introduction
(Semiconductor Manufacturing & Design, Mar 04)

Facilities 450mm Consortium Strengthens Capabilities Portfolio With New Member Busch Vacuum Pumps and Systems
(TMCnet.com, Mar 04)

New SEMICON Europa in Grenoble to Emphasize Innovation and Applications
(EMS Now, Mar 04)

Advantest VOICE 2014 Conference to Feature Robust Technical Program With More Than 100 Papers
(Investing & Stock Research - Businessweek, Mar 04)

January Chip Sales Top $26 Billion
 (Electronic Engineering Times, Mar 03)

New SEMICON Europa in Grenoble to emphasize innovation and applications
 (Solid State Technology (Blog), Mar 03)

Slideshow: Twelve shakers and movers in MEMS
 (EE Times Europe, Mar 03) 

The Final Deadline For EUV
(Semiconductor Engineering, Feb 27)

Top Ten Semi R&D Spenders
(Electronics Weekly, Feb 26)

Call for Papers Open for SEMICON Europa 2014 and Plastic Electronics 2014
(TMCnet.com, Feb 26)

President Obama Announces Two New Public-Private Manufacturing Innovation Institutes and Launches the First of Four New Manufacturing Innovation Institute Competitions
(Press Release Point, Feb 25)

North American semiconductor equipment industry posts January 2014 book-to-bill ratio of 1.04, says SEMI
(Digitimes, Feb 24)

New Challenges For Post-Silicon Channel Materials
(Semiconductor Engineering, Feb 21)

N.A. Semiconductor Equipment Book-to-Bill Ratio at 1.04
(PCB007 IConnect007, Feb 21)

EUV Start-Up Backed By Intel, Samsung and Applied
(Electronics Weekly, Feb 21)

Executive Insight: Luc Van den hove
(Semiconductor Engineering, Feb 20)

Driving Innovation: From Talk to Action
(Semiconductor Engineering, Feb 20)

No technical barriers seen for 450mm
(Semiconductor Manufacturing & Design, Feb 19)

Next-Generation Lithography
(Semiconductor Engineering, Feb 19)

GlobalFoundries turns up the tech [The Post-Star, Glens Falls, N.Y. :: ]
(TMCnet.com, Feb 17)

Europe’s Plan For 20% World Semiconductor Market Share
(Electronics Weekly, Feb 17)

Potentially revolutionnary material: Novel form of artificial graphene
(Science Daily, Feb 14)

ST central to Europe’s future in microelectronics
(Electronics Weekly, Feb 14)

Device that listens to bacteria
(TMCnet.com, Feb 12)

The Will o’ the IC Wisp
(Electronics Weekly, Feb 11)

Exploring the MEMS-Enabled Life: A Preview of MEMS Executive Congress Europe 2014
(Semiconductor Manufacturing & Design, Feb 10)

Air Products Receives Gold Level Boeing Performance Excellence Award
(Investing & Stock Research - Businessweek, Feb 10)

Obama State of the Union Calls for a “Year of Action”— Highlighting Multiple Industry Priorities
(Semiconductor Manufacturing & Design, Feb 07)

A square peg in a round hole: The economics of panel-based lithography for advanced packaging
(Solid State Technology (Blog), Feb 07)

IBM exploring sale of chip operations, making Intel, Global Foundries potential shoppers
(Silicon Valley Business Journal, Feb 07)

Silicon reclaim wafer market increased 14% in 2013
(Solid State Technology (Blog), Feb 06)

MEDIA ALERT: Advantest to Exhibit at SEMICON Korea 2014 in Seoul COEX February 12-14
(TMCnet.com, Feb 06)

Executives debate innovation drivers and cost reduction in microelectronics supply chain
(Solid State Technology (Blog), Feb 05)

SEMI ISS: scaling innovation
(Solid State Technology (Blog), Feb 03)

3D IC ramp up: what can we learn from MEMS?
(EE Times Europe, Feb 03)

Sales record ends chip industry's year
(EE Times Europe Analog, Feb 03)

Europe Leaders to Examine EC's Ambitious Goal  20% Market Share of Global Semiconductor Manufacturing by 2020
(EMS Now, Feb 03)

2014 Capital Spending Up in Korea; SEMICON Korea 2014 to Address Mobile Innovation
(TMCnet.com, Jan 31)

Is graphene a real opportunity or just hype?
(EE Times Europe, Jan 31)

Top-13 foundries account for 91% of total foundry sales in 2013, says IC Insights
(Digitimes, Jan 29)

Europe leaders to examine EC’s ambitious goal
(Solid State Technology (Blog), Jan 27)

Paradigm shift: Semi equipment tells the future
(Solid State Technology (Blog), Jan 27)

Faltering 450mm?
(Electronics Weekly, Jan 27)

Book-to-bill ratio continues to improve
(Solid State Technology (Blog), Jan 24)

2014 Outlook: An era of unprecedented change
(Solid State Technology (Blog), Jan 24)

What’s After CMOS?
(Semiconductor Engineering, Jan 24)

Intel vs. TSMC: An Update
(Solid State Technology (Blog), Jan 21)

GDP forecasts improving.
(Electronics Weekly, Jan 21)

Besi and Imec collaborate on thermocompression technology for high-accuracy narrow-pitch bonding of 3D ICs
(Display Plus, Jan 20)

With President Announcement in North Carolina Today, Sen. Brown's Bill to Create Network of Manufacturing Innovation Gains Momentum
(TMCnet.com, Jan 20)

Semiconductor plastic packaging materials market to approach $21B by 2017
(Solid State Technology (Blog), Jan 15)

Economic recovery and pervasive computing to propel semiconductor manufacturing supply chain
(Solid State Technology (Blog), Jan 14)

The magic behind the gadget and the need for innovation
(Semiconductor Manufacturing & Design, Jan 13)

2014 will be a ‘more than stunning’ growth year for equipment sales, says SEMI.
(Electronics Weekly, Jan 13)

Mixed Signals Seen For Fab Tool Industry
(Semiconductor Engineering, Jan 13)

Memory boom drives global semi sales
(New Electronics, Jan 06)

Memory Sector Drives Semiconductor Sales Recovery in 2013
(PCB007 IConnect007, Jan 03)

NY's GlobalFoundries chip plant to get up to $10B boost
(CNET News, Jan 03)

Kroes’ 20% plan for Europe’s semis is on track
(Electronics Weekly, Jan 03)

Taiwan panel makers expected to maintain profits in 2014
(Digitimes, Jan 02)

Printed electronics gets serious about manufacturing
(Semiconductor Engineering, Jan 01)

2013 News Archive