November 2010

In This Issue

Fab Investments Planned for Japan

450 mm Wafer Transition

Protecting Semiconductor Equipment IP Rights

Taiwan Takes Its Place Among Industry Leaders

Foundry/Assembly Partnerships Move the Industry Forward in TSV Technology

Printed Electronics: a "Game Changing" Technology

Updated SEMI Safety Guidelines Address Multiple Issues

Fab Investments Planned for Japan
By Dan Tracy, SEMI Industry Research and Statistics
The semiconductor industry has seen many changes over the past decade, with the pace of change accelerating as a consequence of the recent financial crisis. Japan remains the country with the largest installed fab capacity base and is the largest market consuming semiconductor materials.

450 mm Wafer Transition
By Jonathan Davis, president, Semiconductor Business Unit
The transition of semiconductor manufacturing to 450 mm wafers is a challenging issue in our industry. Advocates claim larger wafers are necessary to keep pace with Moore's Law; opponents claim it will restructure the industry, negatively impact profitability, and drain R&D funding.

Protecting IP for Semiconductor Equipment
Using Section 337 Investigations at the U.S. ITC to Protect IP Rights relating to Semiconductor Equipment
By Gary Hnath, Mayer Brown
Semiconductors are the heart of most technological progress in the last few decades, and the equipment used to test and manufacture semiconductors is critical. This article explores how companies can use Section 337 investigations at the U.S. International Trade Commission to protect IP rights.

Taiwan Takes Its Place Among Industry Leaders
By Bettina Weiss, executive director, PV Group
Taiwan's high-tech industry is one of the great success stories in the world economy, with companies that are leaders in manufacturing in key categories such as flat panel displays, computer chips, routers, notebook computers, and now PV.

Foundry and Assembly Partnerships Move the Industry Forward in TSV Technology
By E. Jan Vardaman, TechSearch International, Inc.
Performance requirements such as increased bandwidth, reduced latency, and lower power are driving the adoption of 3D ICs designed with TSVs. The relationships between the foundry and the semiconductor assembly and test (OSAT) service providers are becoming increasingly critical as the industry moves toward 3D integration.

Building a Bright Future for LEDs in 2011

Printed Electronics: a "Game Changing" Technology
By Harry Zervos, technology analyst, IDTechEx
Printed electronics are here! We are witnessing the appearance of new products in the marketplace, and some use "game changing" technologies.

Updated SEMI Safety Guidelines Address Multiple Issues
The EHS Committee approved significant changes to criteria for conformance findings in SEMI S2 and a major rewrite of its guideline for evaluation of equipment (SEMI S7).


Asia Events
Beijing International Microelectronics Symposium
November 4-5

SEMI Japan Standards Meetings
November 14-17

December 1-3

SEMICON Korea 2011
January 26-28

LED Korea 2011
January 26-28

Europe Events
ISS Europe
February 27-March 1

North America Events
International Trade Partners Conference
November 8-10

North America Fall Standards Meetings
November 8-11

ISS 2011: Role of Capital Efficiency Through Cycles
January 9-12

SMC 2011: Material Innovation: Catalyst for Success
January 12-14

Combating Aggressive Supply Chain Mgmt

Call for Papers
ASMC 2011

Thank you for reading this newsletter. We hope that you find SEMI Global Update informative and relevant. Let us know if we can improve the content and quality of SEMI Global Update. Please send your ideas, comments and suggestions to:

Deborah Geiger
Content Manager, SEMI
3081 Zanker Road, San Jose, California, 95134
Tel: 1.408.943.6900; Fax: 1.408.428.9600; Email:

Subscribe ¦ Unsubscribe

Copyright © Semiconductor Equipment and Materials International (SEMI), all rights reserved