SEMICON Europa 2006 - Lead-free
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Lead-Free Solutions for Assembly and Packaging
Wednesday 5 April 2006, 10:30-17:00 (Day 1)
Thursday 6 April 2006, 10:00-15:00 (Day 2)
SEMI Technology Arena in Hall A3 – New Munich Trade Fair Centre, Germany
In conjunction with SEMICON Europa 2006
As the 1 July 2006 deadline for the implementation of the EU Directive on the "Restriction of Use of Hazardous Substances" (RoHS) approaches, SEMI Europe and ELFNET join their efforts and competencies by offering two days of presentations on technology and industry solutions to ban lead in electronic components and equipment manufacture and assembly.
On Wednesday 5 April morning, the first session offers an update of EU’s EHS (Environment, Health & Safety) regulatory and legislative framework and on corresponding directives. Following on Wednesday 5 April afternoon and Thursday 6 April, a series of technical presentations will be made by the most technology advanced companies in the lead-free area.
Solutions to important issues identified by the experts of the ELFNET network for the adoption of lead-free processes in microelectronics packaging and assembly will be detailed and exemplified.
Agenda
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Wednesday 5th April |
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Update on EU Legislation on Environment Health & Safety |
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Chairperson: Pierre Lucas – SEMI Europe | ||
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10:30 - 11:00 |
Keynote Speech by representative of the European Commission or Industry (to be confirmed) | |
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11.00 – 11.30 |
Keith Huckle
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REACH - so what happens next? |
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11.30 – 12.00 |
Aimee Bordeaux
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The Regulatory Landscape of PFOS/PFAS/PFOA |
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12.00 – 12.30 |
Julian Lageard
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New energy efficiency requirements and beyond |
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12.30 – 13.00 |
Paul Goodman
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Latest developments in approaches to compliance with the RoHS Directive |
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Supply Chain Issues I | ||
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Chairperson: Andy Longford, PandA Europe | ||
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13:15 - 13:35 |
Jeremy Pearce,
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ELFNET Project Overview |
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13:35 - 13:55 |
John Jones (IGG)
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Obsolescence |
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13:55 - 14:15 |
Dietmar Vieth FarnellinOne |
Component Supply |
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Supply Chain Issues II | ||
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Chairperson: Jeremy Pearce, ELFNET Coordinator | ||
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14:30 - 14:50 |
Walter Huck
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Marking & Labelling |
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14:50 - 15:10 |
Tom Perrett,
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Compliance Testing |
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15:10 - 15:30 |
Gerd Schulz, ZVEI |
Materials Declaration |
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Lead-Free Standards | ||
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Chairperson: Knut Aune, Abelia | ||
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16:45 - 16:05 |
Valentine Menuet
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IECQ HSPM Certification |
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16:05 - 16:25 |
Lars Wallin
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IPC “lead free” Standards |
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16:25 - 16:45 |
Bob Pfahl iNEMI |
Overview of iNEMI Projects on Pb-Free and RoHS Compliance |
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16.45 – 17.00 |
Andy Longford
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Lead-Free applicable to Semiconductor Standards |
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Thursday 6th April |
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Design | ||
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Chairperson: Jacob Klerk, Philips | ||
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10:00 - 10:20 |
Trygve Torma
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Large & Complex Boards |
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10:20 - 10:40 |
Thomas Ahrens
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Lead-Free Best Practice for SME’s |
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10:40 - 11:00 |
Paul Connelly
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SnAgCu Formulations |
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Materials | ||
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Chairperson: Jan Eite Bullema, TNO | ||
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11:15 - 11:35 |
Antonello Vicenzo
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Tin Whiskers |
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11:35 - 11:55 |
Per Johander
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Laminates |
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11:55 - 12:15 |
Clemens Schmetterer
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Lead-Free Solder Alloy Properties |
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Process | ||
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Chairperson: Dag Andersson, IVF Industrial R&D Corporation | ||
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12:30 - 12:50 |
Erik Veninga
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Hand Soldering |
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12:50 - 13:10 |
Anders Ekelof
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Rework & Repair |
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13:10 - 13:30 |
Toni Mattila
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The Role of Intermetallics |
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Reliability | ||
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Chairperson: Claire Ryan, University of Limerick | ||
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13:45 - 14:05 |
Guenter Grossmann
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State-of-the-Art in Lead-Free Reliability |
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14:05 - 14:25 |
Bart Vandervelde
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Lead-Free Reliability Data |
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14:25 - 14:45 |
Clive Simmonds
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Aerospace & Defence Sector Perspective |
In cooperation with:
ELFNET SEMICON Europa program page
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Price:
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Before 03 March 2006 – SEMI-Member euro20 / Non-Member euro30
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