SEMICON Europa 2006 - Lead-free

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Lead-Free Solutions for Assembly and Packaging

Wednesday 5 April 2006, 10:30-17:00 (Day 1)
Thursday 6 April 2006, 10:00-15:00 (Day 2)
SEMI Technology Arena in Hall A3 – New Munich Trade Fair Centre, Germany
In conjunction with SEMICON Europa 2006

As the 1 July 2006 deadline for the implementation of the EU Directive on the "Restriction of Use of Hazardous Substances" (RoHS) approaches, SEMI Europe and ELFNET join their efforts and competencies by offering two days of presentations on technology and industry solutions to ban lead in electronic components and equipment manufacture and assembly.

On Wednesday 5 April morning, the first session offers an update of EU’s EHS (Environment, Health & Safety) regulatory and legislative framework and on corresponding directives. Following on Wednesday 5 April afternoon and Thursday 6 April, a series of technical presentations will be made by the most technology advanced companies in the lead-free area.

Solutions to important issues identified by the experts of the ELFNET network for the adoption of lead-free processes in microelectronics packaging and assembly will be detailed and exemplified.


Wednesday 5th April

Update on EU Legislation on Environment Health & Safety

Chairperson: Pierre Lucas – SEMI Europe


10:30 - 11:00

Keynote Speech by representative of the European Commission or Industry (to be confirmed)


11.00 – 11.30

Keith Huckle
Dow Corning

REACH - so what happens next?

11.30 – 12.00

Aimee Bordeaux

The Regulatory Landscape of PFOS/PFAS/PFOA

12.00 – 12.30

Julian Lageard
Intel Corporation

New energy efficiency requirements and beyond

12.30 – 13.00

Paul Goodman

Latest developments in approaches to compliance with the RoHS Directive


Supply Chain Issues I


Chairperson: Andy Longford, PandA Europe


13:15 - 13:35

Jeremy Pearce,
ELFNET Coordinator

ELFNET Project Overview

13:35 - 13:55

John Jones (IGG)
Component Obsolescence Group


13:55 - 14:15

Dietmar Vieth


Component Supply


Supply Chain Issues II


Chairperson: Jeremy Pearce, ELFNET Coordinator


14:30 - 14:50

Walter Huck

Marking & Labelling

14:50 - 15:10

Tom Perrett,

Compliance Testing

15:10 - 15:30

Gerd Schulz,


Materials Declaration


Lead-Free Standards


Chairperson: Knut Aune, Abelia


16:45 - 16:05

Valentine Menuet
IECQ Representative

IECQ HSPM Certification

16:05 - 16:25

Lars Wallin

IPC “lead free” Standards

16:25 - 16:45

Bob Pfahl


Overview of iNEMI Projects on Pb-Free and RoHS Compliance

16.45 – 17.00

Andy Longford
PandA Europe

Lead-Free applicable to Semiconductor Standards

Thursday 6th April



Chairperson: Jacob Klerk, Philips


10:00 - 10:20

Trygve Torma
NERA Networks

Large & Complex Boards

10:20 - 10:40

Thomas Ahrens

Lead-Free Best Practice for SME’s

10:40 - 11:00

Paul Connelly

SnAgCu Formulations




Chairperson: Jan Eite Bullema, TNO


11:15 - 11:35

Antonello Vicenzo
Politecnico de Milano

Tin Whiskers

11:35 - 11:55

Per Johander
IVF Industrial R&D Corporation


11:55 - 12:15

Clemens Schmetterer
University of Vienna

Lead-Free Solder Alloy Properties




Chairperson: Dag Andersson, IVF Industrial R&D Corporation


12:30 - 12:50

Erik Veninga

Hand Soldering

12:50 - 13:10

Anders Ekelof
Ericsson AB

Rework & Repair

13:10 - 13:30

Toni Mattila
Helsinki University of Technology

The Role of Intermetallics




Chairperson: Claire Ryan, University of Limerick


13:45 - 14:05

Guenter Grossmann

State-of-the-Art in Lead-Free Reliability

14:05 - 14:25

Bart Vandervelde

Lead-Free Reliability Data

14:25 - 14:45

Clive Simmonds
BAE Systems

Aerospace & Defence Sector Perspective


In cooperation with:

Link to ELFNET website

ELFNET SEMICON Europa program page

(for each day)

Before 03 March 2006 – SEMI-Member euro20 / Non-Member euro30
After 03 March 2006 – euro40


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