Industry Leaders to Convene and Collaborate at ITPC
Balancing short-term goals with more important long-term strategic objectives is critical for executives. An example: Is it more important for you to work in your office the week of November 5—or attend the 23rd Annual International Trade Partners Conference in Hawaii?
Last year, over 200 industry executives—from all over the world—chose to convene in Hawaii. This year, we hope that you will attend. With a focus on global semiconductor manufacturing, technology and trade issues in an informal setting, ITPC is a rare “once a year” opportunity to develop and reinforce valuable relationships in the industry.
The conference keynote will be given by Dr. Chang Gyu Hwang, president and CEO, Semiconductor Business of Samsung Electronics. Other executives presenting include:
- Steve Appleton, chairman of the Board and CEO, Micron Technology
- Shaunna Black, VP, Texas Instruments
- Richard Chang, executive director, president and CEO, SMIC
- Richard Koo, chief economist, Nomura Research Institute
- Michiharu Nakamura, fellow, Hitachi
- Andrew Winston, co-author, Green to Gold: How Smart Companies Use Environmental Strategy to Innovate, Create Value, and Build Competitive Advantage
ITPC 2007 features three executive panels:
1. Growth: Technology Opportunities on the Horizon: Paradigm shifts involve competitive pressures and costs. The challenges of 45 nm and 32 nm require increasing sophistication in device structures, materials, processes, and capital equipment. Industry-leading thinkers and technologists will provide a view of opportunities—that will both challenge and inspire our industry. Moderator: Yoshio Nishi (Stanford University). Panelists: Paolo Gargini (Intel), Tohru Mogami (Selete), Tak Ning (IBM), Michael Polcari (Sematech), Takayasu Sakurai (University of Tokyo), and Luc Van den hove (IMEC).
2. Sustainability: “How Can I Be Green?” Sustainable growth in the semiconductor industry is important to today’s executive. This panel will look at current efforts and corporate actions, and delve into resource-saving fabs, tools and manufacturing methods. The impact of environmental regulations and important steps will also be covered. Moderators: Norm Armour (Applied Materials) and Shigehito Ibuka (Tokyo Electron). Panelists include: Seung-Ki Chae (Samsung Electronics), Yu-ichi Mikata (Toshiba Corporation), Farhang Shadman (University of Arizona), and Peter Williams (IBM).
3. Productivity Achievements over the Next Five Years: Predicting the future is risky, but keeping the industry aligned with Moore’s Law will require real productivity achievements in the next half decade. The panelists will discuss improving the productivity of the entire food chain: design environments, mask making, wafer fab FEOL/BEOL, and assembly and test. Moderator: Steve Hillenius (Semiconductor Research Corp.). Panelists: Bob Bruck (Intel), Jin Seog Choi (Hynix), and Shin Horie (Goldman Sachs, Japan), and David Liu (Inotera Memories)
ITPC is organized by SEMI and supported and sponsored by: Air Products, Applied Materials, The Bradbury Group, Babcock & Brown, Edwards, Carmel Chemicals, DISCO, DuPont, Exicon, Fujikin, GE Global Electronics Services, Hitachi High Technologies, Horiba, Lam Research, The Linde Group, Mattson, MKS, Nikon, Semiconductor Research Corporation, and TEL. The media sponsor is Semiconductor International. Sponsorship: please contact Louise Blumenfeld at 1.408.943.7927 or email@example.com.
The International Trade Partners Conference will be held November 4–7, 2007 at the Grand Wailea Resort in Maui, Hawaii. For registration and more information: www.semi.org/itpc.