Register Now: IC Packaging and Assembly, MEMS Design and Fabrication


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Register Now: IC Packaging and Assembly, MEMS Design and Fabrication

Whether you are technical or non-technical, your career growth depends on your knowledge and your skills—and on your management’s perception of your knowledge. This year, take the time to check out two courses—Introduction to IC Packaging and Assembly and Fundamentals of MEMS design and fabrication. Perhaps one of these classes would help you, or would be beneficial to someone you work with. The two classes highlighted here are just a sampling of what is available through SEMI. For a complete list of upcoming courses, click here. These classes can also be held at your company.

The semiconductor industry wants both technical and non-technical staff and personnel to understand the key elements of IC fabrication and design. This course is designed for both the non-technical and technical. It provides a comprehensive overview of the semiconductor industry and technology. The course gives you the background you need to understand the basics of semiconductor devices, how they work, the processing technologies and the equipment used to produce them, and circuit design techniques.

Topics include: electronic fundamentals, crystal growth and wafer types, transistor types (such as bipolar, nMOS, pMOS, CMOS, bi-CMOS), basic design and layout concepts, mask making, wafer processing, materials used for fabricating the wafer, tools used for processing the wafer, contamination control, clean room standards, test, assembly, packaging and IC types.

Currently scheduled open course dates: February 13 in Singapore; February 15 in Penang, Malaysia; March 5 in Portland, Oregon; March 27 in San Jose, California; May 6 in Las Vegas, Nevada. To learn more (or for more available dates), please click here.

This introductory course educates people from any background on the exciting new technologies and markets in MEMS. The course begins with basic fabrication technologies, including traditional methods and the latest techniques. An explanation of the governing equations of these devices, where many things are different from macro-scale electromechanical systems, is explained. Fabrication and design are illustrated with examples of existing and future products in inertial sensors, optical fiber switching, displays, and sensor networks.

Topics include: deposition, lithography, and etching; surface micromachining; deep Reactive Ion Etching; micromechanics and electrostatics; MEMS applications, fabrication, and design; CAD for MEMS; surface (and bulk) micromachining; accelerometers and gyros; pressure sensors; micro optics; fiber switches; projection displays; wireless sensor networks; finite elements, boundary elements, and nodal analysis.

Currently Scheduled Open Course Dates: February 22 in San Jose, CA and at SEMICON West July 17 in San Francisco, California. To learn more, click here.

For more information on technical courses offered at SEMI, please click here.