SEMI Packaging and Test Workshop Will Focus on KGD and 3D Integration


Bookmark and Share

SEMI Packaging and Test Workshop Will Focus on KGD and 3D Integration

SAN JOSE, California– September 9, 2009– The International KGD (Known Good Die) Packaging and Test Workshop 2009 will focus on semiconductor die products test, assembly, manufacturing, and business issues in the microelectronics industry. The workshop is set for October 1-2 in Santa Clara, California.

Keynote presenter Robert Patti, Chief Technology Officer of Tezzaron Semiconductor, will speak on “Merging Ahead with KGD, BIST, and BISR.” His discussion of known good die and built-in semiconductor test and self-repair will cover 3D integration benefits including why the industry must adapt and go beyond current notions of KGD. A special panel will explore a related topic of Co-Design and Co-Simulation developments and issues, moderated by Jan Vardaman and Linda Matthew of TechSearch International.

KGD 2009 sessions include: Testing for 3D Integration, Market Trends, Optimizing IC Manufacturing Methodologies, TSV Update, and Low-Cost Testing, in addition to the panel discussion. This year, the workshop will include focus on enabling KGD for 3D integration, including stacked die packages and through silicon via (TSV) applications.

“This workshop provides a networking opportunity for professionals to discuss the latest developments in the die product industry. Over the years, participants have played a role in shaping the evolution of KGD packaging— from an early focus on specialized high performance systems to the successful low-cost solutions enabling the portable world,” stated Karl Stuber, senior director of Test, Assembly, and Packaging at SEMI.

The workshop also includes “table top” exhibits. Exhibitors will share information in the areas of burn-in and test, plasma etch and deposition systems, transportation and storage solutions, signal integrity engineering, prototype PCBs, software tools for test, and more.

SEMI is the global industry association serving the manufacturing supply chains for the microelectronic, display and photovoltaic industries. SEMI maintains offices in Austin, Bangalore, Beijing, Brussels, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org.

ASSOCIATION CONTACTS:

Steve Buehler/SEMI
Ph: 408.943.7049

E-mail: sbuehler@semi.org

###