SEMICON Singapore 2005 Scheduled for 4-6 May


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SEMICON SINGAPORE 2005 SCHEDULED FOR 4-6 MAY

Keynote Speakers from Chartered Semiconductor, ASE, Singapore EDB

SINGAPORE, 8 April 2005 -- SEMICON Singapore, Southeast Asia's largest exposition dedicated to semiconductor manufacturing technology, will take place 4-6 May at the Singapore International Convention and Exhibition Centre (SICEC). The event is presented by SEMI and supported by the Singapore Exhibition & Convention Bureau (SECB).

The exposition will feature more than 650 display booths showcasing advanced manufacturing equipment, materials and services for the production, testing and packaging of semiconductors and related technologies.

“Capital equipment investment in Singapore totaled $1.7 billion in 2004 and spending on semiconductor materials was $1.1 billion, according to SEMI market data. SEMICON Singapore has successfully served the final manufacturing market of the semiconductor industry for the last 10 years. Now, the expo is gaining momentum as a venue for serving the wafer processing market as well,” said George C.T. Lin, president of SEMI Southeast Asia.

In addition to the three days of exhibition, SEMICON Singapore offers four days of business and technical programmes.

The SEMI Market Trends Briefing on 4 May will feature a keynote address by Chia Song Hwee, president and CEO, Chartered Semiconductor Manufacturing Ltd. Other invited speakers will represent the Singapore Economic Development Board, Singapore Telecommunications (SingTel), and TechSearch International. SEMI will present an overview of the semiconductor capital equipment markets, including trends in IC assembly and test.

Technical programmes include the SEMI Technology Symposium (STS) from 3-6 May, focusing on advanced IC packaging and wafer processing issues; the Standards Technical Education Programme (STEP) on 3 May, providing an overview on the SEMI 300 mm equipment communications standards; and a workshop on e-manufacturing guidelines and standards, on 4 May.

The keynote speaker for the Test, Assembly and Packaging (TAP) sessions will be Tien Wu, president of ASE Americas and Europe, who will speak on the topic of the “Changing Business Landscape in IC Packaging and Test”. The keynote for the wafer processing sessions will be given by K.C. Ang, senior vice president, Chartered Semiconductor Manufacturing Ltd.

For more information on the technical programmes, please contact Cindy Chan, email; cchan@semi.org, or visit SEMI at www.semi.org/semiconsingapore.

SEMI is a global industry association for companies participating in the microelectronics and display industries. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (Calif.), Seoul, Singapore, Tokyo, Shanghai and Washington, D.C. For more information, visit SEMI at www.semi.org.

ASSOCIATION CONTACTS:

Jonathan Davis/SEMI
Ph: 408.943.6937
E-mail: jdavis@semi.org

Irene Yu/SEMI Southeast Asia
Ph: 65.6339.6361
E-mail: iyu@semi.org