IM Flash Technologies to Present at SEMI Strategic Business Conference


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IM Flash Technologies, the Chip Industry’s Newest IC Manufacturer, to Present at SEMI Strategic Business Conference (SBC) on April 24

Conference to Feature Presentation by IM Flash Technologies’ Executive Officer Rod Morgan

SAN FRANCISCO, Calif. — April 5, 2006 — SEMI today announced that Rod Morgan, executive officer of IM Flash Technologies, will deliver a presentation at SBC 2006, a leading chip-industry conference hosted by SEMI for manufacturing and technology executives and their suppliers, April 24-26 in Napa, California.

As a joint venture between Intel Corp. and Micron Technology Inc., IM Flash Technologies is the industry’s newest integrated circuit manufacturer and has announced plans to produce NAND Flash memory for use in consumer electronics, removable storage, and handheld communication devices. Initial manufacturing will take place in Micron’s Manassas, Virginia and Boise, Idaho fabs; while its 300mm fab is being built in Lehi, Utah.

Morgan, who will speak during the first day of the conference on Monday, April 24, joins an impressive roster of speakers at SBC 2006, including Dr. Eli Harari, chairman, president and CEO of SanDisk Corp., who will give the keynote, in addition to representatives from companies such as Samsung, Texas Instruments, Xilinx, and UMC.

Hosted annually by SEMI, SBC provides attendees with a forum that enables one-on-one conversations with leading industry manufacturing and technology executives from IDMs and foundries. The theme for SBC 2006 is “Moore's Law for Business: Keeping Ahead of the Competition and Customer Expectations.”

SBC 2006 is expected to draw an audience of leading senior executives from SEMI member companies, business and industry analysts, and others within the electronics supply chain. To register, or for additional information, call (408) 943-6900 or visit www.semi.org/sbc.

SEMI is a global industry association serving companies that provide equipment, materials and services used to manufacture semiconductors, displays, nano-scaled structures, micro-electromechanical systems (MEMS) and related technologies. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (California), Seoul, Shanghai, Singapore, Tokyo and Washington, D.C. For more information, visit www.semi.org.

ASSOCIATION CONTACT:
Scott Smith/SEMI
Tel: +1 408.943.7957
E-mail: ssmith@semi.org

AGENCY CONTACT:
Loren Sutherland/LG
Tel: +1 415.882.9494
E-mail: sutherlandl@loomisgroup.com