SEMI Publishes Eight New Technical Standards
SEMI PUBLISHES EIGHT NEW TECHNICAL STANDARDS
Documents Provide Cost Savings in FPD, Semiconductor Manufacturing
San Jose, Calif., June 2, 2006 -- SEMI has published eight new technical standards applicable to the semiconductor, flat panel display (FPD) and MEMS manufacturing industries. The new standards, developed by technical experts from equipment suppliers, device manufacturers and other companies participating in the SEMI International Standards Program, are available for purchase in CD-ROM format or can be downloaded from the SEMI website, www.semi.org.
SEMI Standards are published three times a year. The new standards, part of the July 2006 publication cycle, join more than 720 standards that have been published by SEMI during the past 33 years.
The standards include safety guidelines for hydrogen peroxide storage and handling systems, specifications for critical dimension (CD) measurement information data for photomask manufacturing, and test methods for measurement of the resistivity of resin black matrix for LCD color filters.
“These new standards, which include several specifications applicable to the flat panel display (FPD) manufacturing industry, will help reduce manufacturing costs and speed time-to-market,” said Bettina Weiss, SEMI director of International Standards.
The new standards released today include:
Specification for Reference Position of Single Substrate for Handing Off on Tool
Test Methods for Measurement of Resistivity of Resin Black Matrix for LCD Color Filters
Terminology for FPD Polarizing Films
SECS-II Protocol for Recipe and Parameter Management (RaP)
Test Method for Effective Work Function Extraction in Oxide and High-K Gate Stacks Using the MIS Flat Band Voltage-Insulator Thickness Technique
Specification for Critical Dimension (CD) Measurement Information Data on Photomask by XML
Safety Guideline for Hydrogen Peroxide Storage and Handling Systems
Specification for Substrate Traceability
In addition to the above standards, the SEMI S2 safety specification is being updated with additional and corrected material from the last two years. This version of SEMI S2 is the first in a planned tri-annual revision process, with the next SEMI S2 update scheduled for 2009.
The SEMI Standards Program, established in 1973, covers all aspects of semiconductor process equipment and materials, from wafer manufacturing to test, assembly and packaging, in addition to the manufacture of flat panel displays and micro-electromechanical systems (MEMS). About 1,500 volunteers worldwide participate in the program, which is made up of 17 global technical committees. Visit www.semi.org/standards for further details about SEMI Standards.
SEMI is a global industry association serving companies that provide equipment, materials and services used to manufacture semiconductors, displays, nano-scaled structures, micro-electromechanical systems (MEMS) and related technologies. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (Calif.), Seoul, Shanghai, Singapore, Tokyo and Washington, D.C. For more information, visit www.semi.org.
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