Richard E. Dyck President of TCS-Japan Presented Bob Graham Award


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Bob Graham Award for Semiconductor Equipment and Materials Industry Marketing Presented to Richard Dyck

HAWAII, HI – November 7, 2006 – SEMI today presented the eighth annual Bob Graham Award for outstanding contributions in semiconductor equipment and materials marketing to Richard E. Dyck, president of TCS-Japan. The award was presented at the SEMI International Trade Partners Conference (ITPC) award dinner at the Fairmont Orchid Resort in Hawaii, Hawaii.

Dyck was nominated for facilitating greater cultural awareness and business relationships between the Japanese semiconductor industry and the U.S. semiconductor industry. He contributed greatly to the development of the industry in Japan and played a pivotal role in expanding the opportunities for U.S. equipment suppliers there.

“Rick Dyck's contributions to the semiconductor equipment industry began with his successful role at Teradyne in Japan and went on to include a pioneering role in global marketing practices that strengthened trade and technology relationships between U.S. and Japanese enterprises,” said Stanley T. Myers, president and CEO of SEMI. “He has remained deeply involved with the industry by continuing to promote the relations that have proven vital to its worldwide development.”

After earning his Ph.D. at Harvard University in the 1970s, Dyck held teaching posts at Harvard and Ohio State University. He began his professional career at General Electric, ultimately serving as general manager for Asia for its Specialty Materials Division. In 1982, Dyck joined Teradyne as general manager of the automated test equipment (ATE) business in Japan. He recognized that Japan was a unique market requiring very close supplier-customer relationships, and led the development of Japan-based design, engineering, manufacturing, and support for Teradyne products. As the industry continued to expand, he led the development of sales and support offices throughout Asia.

He founded TCS-Japan in 1999, after acquiring the Japanese operations of Teradyne’s backplane connection system business. Currently, he is serving as president of the company, which has subsidiaries in the United States and China. Dyck divides his time between his homes in Tokyo and Shanghai.

Dyck has supported SEMI activities for many years. He was instrumental in the development of the SEMI International Trade Partners Conference, the industry's premier global executive forum for interaction among the world's semiconductor producers and their manufacturing technology providers.

He also was a leading proponent of the SEMI Japan Trade Study Group, which promoted greater familiarity, trust and cooperation at a time when US-Japan trade friction threatened mutually beneficial business interactions.

His international perspective is illustrated by his role as an advisor to the successive U.S. ambassadors in Japan and he was recognized for his contribution to U.S.-Japan relations by Prime Minister Keizo Obuchi in 1999.

The Bob Graham Award was established to honor individuals for the creation and/or implementation of marketing programs that enhance customer satisfaction and further the growth of the semiconductor equipment and materials industry. The award is named in honor of the late Bob Graham, the distinguished semiconductor industry leader who was part of the founding team of Intel and who helped establish industry-leading companies Applied Materials and Novellus Systems.

Eligible candidates are nominated by their industry peers and are selected by an award committee comprised of members of the Sales and Marketing Executive Council of SEMI (SMECS), which includes past recipients of the Bob Graham Award. Previous recipients include Art Zafiropoulo (2000), Jim Healy and Barry Rapozo (2001), Jerry Hutcheson and Ed Segal (2002), Steve “Shigeru” Nakayama (2003), Edward Braun (2004), Archie Hwang (2005) and Aubrey C. (Bill) Tobey (2006.).

SEMI is a global industry association serving companies that provide equipment, materials and services used to manufacture semiconductors, displays, nano-scaled structures, micro-electromechanical systems (MEMS) and related technologies. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (Calif.), Seoul, Shanghai, Singapore, Tokyo and Washington, D.C. For more information, visit www.semi.org.

ASSOCIATION CONTACT:
Scott Smith/SEMI
Tel: 1.408.943.7957
E-mail: ssmith@semi.org

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