December 2007 Book-to-Bill Ratio of 0.89


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North American Semiconductor Equipment Industry Posts December 2007 Book-to-Bill Ratio of 0.89

SAN JOSE, Calif. – January 17, 2008 – North American-based manufacturers of semiconductor equipment posted $1.23 billion in orders in December 2007 (three-month average basis) and a book-to-bill ratio of 0.89 according to the December 2007 Book-to-Bill Report published today by SEMI. A book-to-bill of 0.89 means that $89 worth of orders were received for every $100 of product billed for the month.

The three-month average of worldwide bookings in December 2007 was $1.23 billion. The bookings figure is about nine percent greater than the final November 2007 level of $1.13 billion and 18 percent less than the $1.50 billion in orders posted in December 2006.

The three-month average of worldwide billings in December 2007 was $1.38 billion. The billings figure is about flat with the final November 2007 level of $1.38 billion and about seven percent less than the December 2006 billings level of $1.48 billion.

"In 2007, North American equipment makers experienced a modest two percent growth in their global billings," said Stanley T. Myers, president and CEO of SEMI. "Most recent booking levels are 18 percent below one year ago, and reflect the general expectation that capital expenditures will be about 10 percent lower in 2008."

The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars.

 

    Billings

    (Three-month avg.)

    Bookings

    (Three-month avg.)

    Book-to-Bill

July 2007

    1,685.8

    1,406.3

    0.83

August 2007

    1,682.3

    1,371.2

    0.82

September 2007

    1,557.4

    1,235.0

    0.79

October 2007

    1,477.5

    1,176.9

    0.80

November 2007 (final)

    1,383.2

    1,130.7

    0.82

December 2007 (prelim.)

    1,376.9

    1,227.8

    0.89

Source: SEMI January 2008

The data contained in this release was compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.

The data are contained in a monthly Book-to-Bill Report published by SEMI. The report tracks billings and bookings worldwide of North American-headquartered manufacturers of equipment used to manufacture semiconductor devices, not billings and bookings of the chips themselves.

SEMI is the global industry association serving the manufacturing supply chains for the microelectronic, display and photovoltaic industries. SEMI member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org.

Association Contacts

Dan Tracy/SEMI

Tel: 1.408.943.7987

E-mail: dtracy@semi.org

Scott Smith/SEMI

Tel: 1.408.943.7957

E-mail: ssmith@semi.org

Editors Note:

The January 2008 SEMI Book-to-Bill Report is scheduled for publication on February 21, 2008; 3:00 p.m. PDT (subject to change).

Independently from SEMI, The Semiconductor Equipment Association of Japan (SEAJ) releases its July Book-to-Bill Report on approximately the same date. The SEAJ Book-to-Bill Report tracks billings and bookings worldwide of Japanese-headquartered semiconductor equipment manufacturers. For more information on the SEAJ data, visit www.seaj.or.jp

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