SEMI Publishes Eight New Technical Standards


Bookmark and Share

SEMI PUBLISHES EIGHT NEW TECHNICAL STANDARDS

Documents Include FPD Safety Guidelines, Substrate Handling Method

SAN JOSE, Calif. – February 11, 2008 – SEMI has published eight new technical standards applicable to the semiconductor, flat panel display (FPD) and MEMS manufacturing industries. The new standards, developed by technical experts from equipment and materials suppliers, device manufacturers and other companies participating in the SEMI International Standards Program, are available for purchase in CD-ROM format or can be downloaded from the SEMI website, www.semi.org.

SEMI Standards are published three times a year. The new standards, part of the March 2008 publication cycle, join more than 770 standards that have been published by SEMI during the past 34 years.

“These SEMI Standards represent new ground the volunteers in the SEMI International Standards Program have broken over the years, including two new standards applicable to FPD manufacturing,” said Bettina Weiss, SEMI director of International Standards. “As the FPD industry grows and technical requirements are defined earlier and in concert with suppliers and panel makers, these new specifications provide critical solutions to manufacturing challenges.”

The standards released today include a test method for determining the leak integrity of gas delivery systems, a guide for design and materials for interfacing MEMS microfluidic systems, and environmental, health and safety (EHS) guidelines for FPD manufacturing.

The full list of SEMI Standards released today include:

SEMI C64
SEMI Statistical Guidelines For Ship To Control

SEMI C65
Guideline for Trimethylsilane (3MS), 99.995% Quality

SEMI C66
Guidelines for Trimethylaluminium (TMAl), 99.5% Quality

SEMI D51
Specification for Handshake Method of Single Substrate for Handing Off/On Tool in FPD Production

SEMI F106
Test Method for Determination of Leak Integrity of Gas Delivery Systems by Helium Leak Detector

SEMI M72 (Preliminary)
Test Method for Determining Wafer Flatness Using the Moving Average Qualification Metric Based on Scanning Lithography

SEMI MS6
Guide for Design and Materials for Interfacing Microfluidic Systems

SEMI S26
Environmental, Health, and Safety Guideline for FPD Manufacturing System

The SEMI Standards Program, established in 1973, covers all aspects of semiconductor process equipment and materials, from wafer manufacturing to test, assembly and packaging, in addition to the manufacture of flat panel displays, photovoltaic systems and micro-electromechanical systems (MEMS). About 1,650 volunteers worldwide participate in the program, which is made up of 18 global technical committees. Visit www.semi.org/standards for further details about SEMI Standards.

About SEMI

SEMI is the global industry association serving the manufacturing supply chains for the microelectronic, display and photovoltaic industries. SEMI member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org.

ASSOCIATION CONTACTS:

Bettina Weiss/SEMI
Tel: 1.408.943.6998
E-mail: bweiss@semi.org

Scott Smith/SEMI
Tel: 1.408.943.7957
E-mail: smith@semi.org

(Editor's Note: Following is more detailed information about the new SEMI standards).

SEMI C64
SEMI Statistical Guidelines For Ship To Control

The SEMI C64 standard provides a consistent and robust statistical methodology for calculating and maintaining ship-to-control limits. The standard applies to incoming process chemical and material quality elements of the manufacturing process.

SEMI C64 will provide a number of cost savings and economic benefits. For example, providing such a material grade exerts pressure on suppliers to both maintain and improve their process control and quality. Better control of raw materials will provide improved control and capability to optimize IDM production processes. IDMs will be able to directly compare supplier capability using a common metric that is based on all relevant supplier process data.

A standardized definition also allows suppliers to define a ship-to-control grade of product that is not unique for each IDM customer. Suppliers and IDMs will obtain the same control limits when this standard’s methodology is applied; reducing the need for further discussion of statistics.

The statistical rule set of SEMI C64 integrates with existing specifications and does not allow ship-to-control product to exceed already existing specifications. The embedded statistical methodologies and tests also have potential additional value in that they can provide better control limits for trace contamination data than those obtained from statistical methodologies currently in common usage.

SEMI C65
Guideline for Trimethylsilane (3MS), 99.995% Quality

Trimethylsilane is a silicon source which can be used for the formation of interlayer dielectric (ILD) and diffusion barrier films for semiconductor devices.

Over the past five to 10 years, in certain areas of memory and logic devices, silicon has started to be replaced by new functional materials. For example, the latest 45nm Intel processor incorporates a hafnium oxide based material for the gate and a metal electrode. As the device industry moves forward and begins to use even more new materials it will be important to have guidelines and standards for chemical precursors that generate these new materials.

For both chemical precursors, SEMI C65 will provide appropriate metal and general contamination information. This information will assist end users in determining what contaminates and at what level these contaminants are important when setting up the deposition process. Additionally, the guideline will assist chemical manufacturers in producing precursors applicable to the various deposition processes.

For both sources, especially TMAl, many different grades and qualities of product are available. While some of the many different grades are application based and therefore unavoidable, for the same application the same grade of material should be applicable. If all end users can use a single grade of material for a specific process, then cost reductions could be possible because chemical manufactures would not need to produce several different grades of the same chemical for the same process.

SEMI C66
Guidelines for Trimethylaluminium (TMAl), 99.5% Quality

Trimethylaluminium (TMA1) has a number of applications in the electronics industry, including deposition of epitaxial films for AlGaAs, AlGaN and InAlGaP by metal organic chemical vapour deposition (MOCVD). These layers find applications in products such as high brightness LEDs and lasers.

More recently TMAl has been used extensively by all the major memory manufacturers for atomic layer deposition (ALD) of aluminium oxide, which is the dielectric layer of choice in DRAM devices.

For both chemical precursors, the SEMI C66 guidelines give appropriate metal and general contamination information. This information will assist end users in determining the source of contaminatiion and at what level these contaminants are important when setting up their deposition process. Additionally, the guideline will assist the chemical manufacturer in producing precursors applicable to the various deposition processes.

SEMI D51
Specification for Handshake Method of Single Substrate for Handing Off/On Tool in FPD Production

The purpose of SEMI D51 is to standardize the handshake methods for transferring large size single substrates between process equipment and transfer systems at FPD fabs.

Since each FPD fab uses different handshake specifications for single substrate transfer, suppliers have to change handshake methods depending on each fab. To solve these issues, it is important to define handshake methods for transferring single substrates to the process equipment.

It is expected that FPD fabs will increasingly apply single substrate transfer for large size substrates and a handshake for single substrate transfer will be utilized in many cases. It is expected that the implementation of this standard will result in improved efficiency in the design, production and installation of equipment, as well as in cost reduction. Using this standard will also improve efficiency in operation and delivery, and realize early startup of the fab.

SEMI F106
Test Method for Determination of Leak Integrity of Gas Delivery Systems by Helium Leak Detector

Gas panels using surface mount components are entering the market as a new gas distribution system technology. However, no test method is available to evaluate both conventional and surface mount types of gas systems. Consequently, test method standards commonly used by suppliers and users are needed, as well as test method standards for the new sealing technologies used for surface mounting.

The SEMI F106 standard covers both conventional metal face sealing and surface mount gas delivery systems. The test method applies to all types of high purity gas delivery system used in semiconductor manufacturing facilities and comparable R&D areas.

The purpose of SEMI F106 is to define a test method to determine the leak integrity of conventional and surface mount gas delivery systems. In general, there are two types of test methods. One is the “inboard leak test” and the other is the “outboard leak test.” However, as far as SEMI F106 is concerned, only inboard leak testing is employed because it is practical for actual testing of gas delivery systems. This test method defines two ways to determine the leak integrity. One is to determine the leak integrity from one seal portion at one time and the other is to determine the leak integrity from the entire gas system at one time by using the hood method. Both ways use inboard leak testing.

SEMI M72 (Preliminary)
Test Method for Determining Wafer Flatness Using the Moving Average Qualification Metric Based on Scanning Lithography

The SEMI M72 standard provides a metric for wafer flatness specification that is consistent with scanning lithography focus control and is applicable to both back and front surface referenced measurements. This test method quantifies the flatness of wafers used in semiconductor device processing in the polished, epitaxial, SOI, or other layer condition through the use of the moving average (MA) as the measurement parameter.

It is also suitable for determining wafer flatness in the near edge region of the wafer. Wafer flatness significantly affects the focus control of lithography equipment and thereby the yield of semiconductor device processing. Knowledge of this characteristic can help both suppliers and users of silicon wafers determine if the dimensional characteristics of a wafer satisfy given geometrical requirements. The test method was developed for 200 and 300 mm diameter wafers having dimensions in accordance with wafer categories 1.9.1, 1.9.2, 1.10.1, 1.10.2, and 1.15 of SEMI M1. It can also be applied to other diameter wafers.

SEMI MS6
Guide for Design and Materials for Interfacing Microfluidic Systems

The SEMI MS6 standard provides a guide for design and materials for interfacing MEMS microfluidic systems. It provides guidelines for general fluidic interface design and materials selection that can reduce redundant engineering efforts and lead to improved design, manufacturability and operation.

SEMI MS6 provides value to the semiconductor manufacturing industry by providing a general resource for assisting in early design and material selection boundary conditions. This can result in shorter time to market products where microfluidics are used.

SEMI S26
Environmental, Health, and Safety Guideline for FPD Manufacturing System

Up to now, the display industry has had no formal EHS guidelines for FPD manufacturing systems despite the increased risk from rapid generation changes of substrate sizes. In the semiconductor manufacturing industry, the existing SEMI S2 document is already widely used. However, the semiconductor and FPD industries are different in terms of equipment concepts. Therefore, it is difficult to apply the same safety guidelines to both industries.

SEMI S26 has been developed specifically for the environment, health, and safety of FPD manufacturing systems, describing the minimum design guidelines related to EHS. This document also includes the criteria for important safety issues in FPD manufacturing.

By adopting these criteria in the equipment specifications, it is possible to standardize safety designs and reduce FPD manufacturing system cost and development time. By conducting the appropriate risk assessment in the design phase, safety measures offering good cost performance can be introduced, resulting in system cost saving.