MEMS Standards Committee Information


Bookmark and Share

Global MEMS / NEMS Committee SEMI Standards Logo

To develop standards for MEMS & NEMS devices that cannot be handled by existing technical committees. Current topics include Wafer Bonding Alignment Targets; Step-Height Measurements of Thin, Reflecting Films using an Optical Interferometer; and Ultra High Purity Microscale Fluidic Systems for Use in Scalable Process Environments.

For more information, contact SEMI Standards at standards@semi.org.

Global MEMS / NEMS Committee Activities

Upcoming SEMI Standards Meetings:

 

Interested in Participating?

SEMI Standards Program Membership is required to participate. Registration is free and quick. Join Now!

 

SEMI MEMS / NEMS Standards

SEMI MS1-0812 Guide to Specifying Wafer-Wafer Bonding Alignment Targets
SEMI MS2-1113 Test Method for Step Height Measurements of Thin Films
SEMI MS3-0307 Terminology for MEMS Technology
SEMI MS4-1113 Standard Test Method for Young's Modulus Measurements of Thin, Reflecting Films Based on the Frequency of Beams in Resonance
SEMI MS5-0813 Test Method for Wafer Bond Strength Measurements Using Micro-Chevron Test Structures
SEMI MS6-0308 Guide for Design and Materials for Interfacing Microfluidic Systems
SEMI MS7-0708 Specification for Microfluidic Interfaces to Electronic Device Packages
SEMI MS8-0309 Guide to Evaluating Hermeticity of MEMS Packages
SEMI MS9-0611 Specification for High Density Permanent Connections Between Microfluidic Devices
SEMI MS10-0912 Test Method to Measure Fluid Permeation Through MEMS Packaging Materials

Quick Links:

 

Balloting Information

 

Contact Us