China Semiconductor Packaging TOC


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China Semiconductor Packaging Market Outlook Report


Table of Contents

Executive Summary

Introduction

  • Methodology
  • Assumptions

China Semiconductor Packaging Industry Outlook

  • Impact of Economic Crisis to China Assembly Market
  • Semiconductor Assembly Industry Trends
  • Low Cost Strategies for Packaging House
  • Packaging and Assembly Market Size and Packaging Type

China Semiconductor Packaging Material Market Outlook

  • Substrate Market
  • Leadframe Market
  • Bonding Wire Market
  • Domestic Packaging Materials Suppliers

China Semiconductor Packaging Equipment Market Outlook

  • Semiconductor packaging Equipment Market Overview
  • China Manufactured Packaging Equipment Market

Summary and Conclusions

Appendices

The report also includes an Excel file (.xls) listing information on packaging companies, wafer bumping fabs, material suppliers, and local equipment manufacturers in China.