China Semiconductor Packaging Market Outlook - Multi-User
Publication Date: January 2010
Principal Analyst: Bin Chou, SEMI Shanghai
Format: .pdf and .xls
There has been strong growth of China’s semiconductor assembly industry over the past several years as foreign semiconductor companies increase their manufacturing presence in China. This trend will continue as the intense pressure to reduce costs drives advanced packaging production to China. Also spurring the growth in packaging in China is the proliferation of semiconductor wafer fabrication and the huge and rapid growth in the domestic electronics end market, especially for mobile phones, personal computers, and other consumer electronics. Though impacted by the global economic crisis, China continues to play an increasingly important role in the semiconductor packaging industry.
This report provides an outlook of the semiconductor packaging industry in China as well as a summary of the packaging materials and equipment for this important market. The report also highlights the material and equipment supply chain in China, including which domestic companies supplying materials and equipment are emerging in the market place.
Bonus: The report also includes an Excel file (.xls) containing the following information:
In-depth personal, telephone, and email interview were conducted with semiconductor manufacturers, packaging subcontractors, assembly equipment manufacturers, and material vendors, as well as with government officials and professionals from industry associations in China. While the majority of the information contained in this report was derived from interviews, a thorough literature search was also conducted. All of this information was analyzed and the findings are summarized in this report.