24th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2013)
The SEMI Advanced Semiconductor Manufacturing Conference continues to fill a critical need in our industry. The conference provides a venue for industry professionals to network, learn and share knowledge on new and best-method semiconductor manufacturing practices and concepts. The conference is co-chaired by Stefan Radloff, Intel Corporation; and Russell Dover, Brion Technologies (an ASML Company).
Who Attends ASMC?
ASMC 2013 schedule includes keynotes, tutorials, a panel, 15 technical sessions, including the popular interactive poster session/reception. On-site registration opens May 13 at 6:30pm. After picking up your conference materials, join your fellow attendees at the ASMC 2013 Welcome Reception for an excellent networking opportunity prior to the conference.
|Keynote: Assessing the Threats to Semiconductor Growth: Technology Limitations versus Economic Realities
Subramani Kengeri, Vice President, Advanced Technology Architecture, Office of the CTO GLOBALFOUNDRIES
|Keynote: Fab Materials Next Generation Challenges: Affordability & Quality
Tim Hendry, Vice President, Technology and Manufacturing Group, Director of Fab Materials Operation
|Keynote: IC Market Trends and Forecast
Bill McClean, President
|Keynote Tutorial: Computational Lithography
Dr. Vivek Singh, Intel Fellow, Technology and Manufacturing Group Director, Intel Corporation
|Tutorial: 3D IC
Sarasvathi Thangaraju, Package Technology and Integration, GLOBALFOUNDRIES
450 mm Wafers - Super Size me!
Paul A. Farrar, Jr., General Manager, G450C
Kirk Hasserjian, Applied Materials
Dr. Brian Trafas, KLA-Tencor
Mark Fissel, Lam Research
Dr. John Lin, TSMC
|Best Paper Awards
SEMI thanks the ASMC committee members, who volunteer countless hours in support of our annual conference.
Make sure you receive the latest information about ASMC 2013. Add your name to the ASMC distribution list.
Authors presenting a technical paper at ASMC 2013, please visit the author instructions for due dates, templates and additional information.
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