December 15, 2020 - December 15, 2021
This 2.5 hour webinar is offered OnDemand from the SEMI Library.
Location
Virtual,
United States
About The Webinar
Defect prediction and defect source mitigation is critical to enabling high-volume manufacturing at all semiconductor fabs, but especially at advanced process nodes. This program will provide perspectives on:
- Importance of OEM part design, cleaning & refurbishment loops for advanced node high volume manufacturing and designing for zero defects
- The standards gap between cleanliness specs, measurement methods & successful predictive maintenance (PdM) in the Fab and how to enable AI based maintenance scheduling
- Applicability of cleaning techniques vs OEM part designs and mitigating human variability during parts cleaning
- The emerging considerations for parts designed to facilitate cleaning
Who Should Attend
- IDMs, fabs, foundries; fab managers, process engineers
- Semiconductor processing equipment OEMs
- Critical chamber component suppliers
- Semiconductor processing equipment parts clean vendors
- Parts clean metrology service providers
Agenda
Welcome Remarks & Moderation
Paul Trio, Senior Manager, Strategic Initiatives
SEMI
OEM Perspective on Parts Cleaning - Cleanliness and Hardware Connectivity
Patrick Martin, Business Development, New Markets and Alliances
Applied Materials
Parts Cleaning from Design to Scrap
David Laube, CTO,
Pentagon Technologies
Cleanliness Metrology
Victor Chia, International Expert; Director, Surface Contamination Technologies
Air Liquide / Balazs NanoAnalysis
Product Cleanliness – International Collaboration Initiatives
Max van den Berg, System Architect, Electronics and Assembly, Global Application Engineering
Festo
Q&A and Closing Remarks
Questions about the webinar? Contact scistc@semi.org
Semiconductor Components, Instruments, and Subsystems (SCIS) is a SEMI technology community chartered to address process-critical components challenges to meet the demands of high-volume manufacturing (HVM) at advanced process nodes. SCIS brings together all stakeholders that are driving yield improvements through the very last frontier of component and hardware defect reduction.