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May 16, 2024

Connected World

SEMI Spring Breakfast Forum

Organized by the SEMI Texas Chapter

Time

8:00 am - 12:00 pm

Add to Calendar 2024-05-16 08:00:00 2024-05-16 12:00:00 2024 SEMI Texas Spring Breakfast Forum SEMI Spring Breakfast ForumOrganized by the SEMI Texas Chapter Texas State University, Round Rock Campus Avery Building, Room 252, Teaching Theatre 1555 University Blvd. Round Rock, TX 78665-8017 United States SEMI.org contact@semi.org America/Chicago public
Location

Texas State University, Round Rock Campus
Avery Building, Room 252, Teaching Theatre
1555 University Blvd.
Round Rock, TX 78665-8017
United States

Connected World

Advancements in Advanced Packaging: Unveiling the Future of Electronics Integration

Delve into the cutting-edge technologies revolutionizing the world of electronics integration. As electronic devices continue to evolve, the demand for smaller, faster, and more efficient packages becomes imperative. This breakfast forum organized by the SEMI Texas Chapter will explore the latest trends, breakthroughs, and innovations in advanced packaging that are reshaping the landscape of electronics manufacturing in Texas and other key areas of the US.

Some key topics to be covered are 3D IC Integration, Fan-Out Wafer-Level Packaging (FOWLP), System-in-Package (SiP) Design, Heterogeneous Integration, Advanced Materials for Packaging and Emerging Technologies.

Agenda

Thursday, May 16, 2024 | Central Time

8:00 am - 8:30 am

Registration and Networking Breakfast

8:30 am - 8:40 am
Michelle Fabiano, SEMI Americas
Michelle Fabiano, IOM
Senior Manager
SEMI Americas

Welcome and Introduction to SEMI’s Advanced Packaging and Heterogeneous Integration (APHI) Newest Technology Community

8:40 am - 8:45 am
Nicole Flores, SEMI
Nicole Flores
Americas Marketing Manager
Huntsman Corporation and Chair, SEMI Texas Committee

Opening Remarks and Introductions

8:45 am - 9:05 am
E. Jan Vardaman_TechSearch International
E. Jan Vardaman
President
TechSearch International

The Role of Chiplets

9:05 am - 9:30 am
Patrick Meyers_Texas Institute of Electronics
Patrick Meyer
Sr. Director of Fab and Facility Operations
Texas Institute of Electronics TIE

Advanced Packaging Expansion in Texas

9:30 am - 10:00 am

Networking Break

10:00 am - 10:20 am
Tim Hossain _Ceriumlabs
Tim Hossain
CTO
Cerium Labs

Material Analysis Techniques for Advanced Packaging Development

10:20 am - 10:40 am
Arsalan Alam, AMD Packaging
Arsalan Alam, PhD
Member of Technical Staff (MTS), 3D Stacking Technology Group
AMD Packaging

2nd Generation 3D V-CacheTM Enablement

10:40 am - 11:00 am
Loic Constantin, Applied Materials
Loic Constantin
Packaging R&D Engineer
Applied Materials

Manufacturing Technology Development for Advanced Packaging

11:00 am - 11:45 am

Panel Discussion

Moderator
Thomas Neumann
Strategic Accounts Manager
Shin-Etsu MicroSi
E. Jan Vardaman_TechSearch International
E. Jan Vardaman
President
TechSearch International
Patrick Meyers_Texas Institute of Electronics
Patrick Meyer
Sr. Director of Fab and Facility Operations
Texas Institute of Electronics (TIE)
Tim Hossain _Ceriumlabs
Tim Hossain
CTO
Cerium Labs
Arsalan Alam, AMD Packaging
Arsalan Alam, PhD
Member of Technical Staff (MTS), 3D Stacking Technology Group
AMD Packaging
Loic Constantin, Applied Materials
Loic Constantin
Packaging R&D Engineer
Applied Materials

Navas Kalandar_InfineonTechnologies
Navas Kalandar
Lead Principal Engineer
Infineon Technologies
11:45 am - 12:00 pm
Nicole Flores, SEMI
Nicole Flores
Americas Marketing Manager
Huntsman Corporation and Chair, SEMI Texas Committee

Closing Remarks & Ken Parmerter Memorial Scholarship Ceremony

12:00 pm

Adjourn

Registration

PRICING
Early Bird (Before May 2nd, 2024):
Member: $75 | Non-member: $100

Regular Pricing (starting May 2nd, 2024):
Member: $100 | Non-member: $125

Cancellation Policy
Registration is final. No refunds provided. No substitutions.

Sponsors

Texas State University Logo 170x65
ASNA Logo 170x65
Conation Technologies Logo 170x65

Become a Sponsor 

Sponsorships can be tailored to meet your branding and marketing objectives. Become a sponsor and brand your company at the Texas Chapter Spring Breakfast Forum.

Contact Michelle Fabiano, mfabiano@semi.org to learn about available sponsorship opportunities.

Program Questions

Contact Michelle Fabiano, mfabiano@semi.org