Critical Process Technologies and Fab Productivity Addressed at Upcoming Semiconductor Manufacturing Conference
Semiconductor manufacturers, suppliers and academia to collaborate on real-world issues at SEMI event
SAN JOSE, Calif. — March 19, 2013 — The 24th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2013) will be held May 13-16 in Saratoga Springs, New York. The conference will feature more than 85 presentations including peer-reviewed manuscripts covering critical process technologies and fab productivity, workshops, and tutorials. This year’s event features a panel discussion on the process and economic challenges of the move to 450mm and 15 technical sessions on advanced semiconductor manufacturing, as well as tutorials on Computational Lithography by Intel Corporation and 3D-ICs by GLOBALFOUNDRIES.
For over two decades, ASMC has provided a premier venue for industry professionals to learn and share knowledge on new and “best practice” semiconductor manufacturing issues and concepts. ASMC provides a valuable source of cost-effective, hands-on solutions to address real-world manufacturing challenges. It is acknowledged as a leading technical conference that enables collaboration and sharing of technical breakthroughs. This year’s conference features keynotes delivered by industry leaders, including:
- “Fab Material Next Generation Challenges: Affordability & Quality” — Tim Hendry, vice president, director of Fab Materials Operation, Intel Corporation
- “IC Market Trends and Forecast” — Bill McClean, president, IC Insights
ASMC 2013 technical sessions include:
- Advanced Patterning/Design for Manufacturing
- Factory Optimization
- 3D/TSV Technology
- Interactive Poster Session
- Yield Enhancement
- Advanced Metrology
- Defect Inspection
- Advanced Equipment Processes and Materials
- E-Beam Inspection
- Advanced Process Control
ASMC also holds an interactive poster session and reception, which provides an ideal opportunity for networking between authors and conference attendees. During this session, participants can engage authors in in-depth discussion of a wide range of issues. New this year is a co-located workshop on May 13 on manufacturing below the 10nm node.
ASMC 2013 is presented by SEMI with technical sponsors: Institute of Electrical & Electronics Engineers (IEEE), IEEE Electron Devices Society (EDS), and IEEE Components, Packaging and Manufacturing Technology Society (CPMT). Corporate sponsors include: Applied Materials, ASML, ATMI, ChemTrace, CNW Courier Network, DAS, Edwards, KLA-Tencor, GLOBALFOUNDRIES, Marcy NanoCenter at SUNYIT, MSP, NY Loves Nanotech, and Valqua.
Registration for ASMC 2013 is available at www.semi.org/asmc2013. For more information contact Margaret Kindling at firstname.lastname@example.org. Qualified members of the media should contact Deborah Geiger (SEMI Public Relations) at email@example.com for media registration information.
SEMI is the global industry association serving the nano- and microelectronics manufacturing supply chains. Our 1,900 member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org.
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