American Semiconductor, Inc.
Apr 15, 2016
268621
American Semiconductor (ASI) is the industry leader in thin chip packaging. ASI’s thin-device capability is based on Semiconductor-on-Polymer™ WLCSP packaging that makes the thinnest chips possible. As the leader in thin and ultra-thin device technology, ASI provides a complete range of services for packaging, assembly, test and related electronic system manufacturing services. ASI's extensive thin-device packaging and chip-on-flex assembly enables us to support your program requirements for new product development, prototyping and volume manufacturing.
Primary Industry
Semiconductor
Primary Product Category
Device Manufacturing
Primary Product Sub Category
Contract Manufacturing (OSAT)
Keywords
SoP, CSP, Flexible, Flexible-hybrid-electronics, OSAT, packaging, flex, chip-on-flex
Website
6987 W. Targee St
Boise
ID
83709