Baud Technology Co., Ltd.
May 30, 2007
132885
Burn-in and Testing, DIP, SOP, CFP, BGAi , GFN, GSP, LGA, KGD (Load Board), Prober Card, Interface & docking systems for Adapter for IC Programmer.
Primary Industry
Semiconductor
Primary Product Category
Materials
Primary Product Sub Category
Test Materials
Website
上海市长宁区天山西路789号B楼604室
上海市
200052