Component Technology Pte., Ltd.
Jan 1, 2003
11188
Analysis/Measurement: Wafer, Die Bond and Wire Bond inspection and process control. Automated X-ray Wire Bond Inspection Software. Assembly/Hybrid Equipment: Die Bonding.
Primary Industry
Semiconductor
Primary Product Category
Services
Primary Product Sub Category
Distributor, Manufacturing Representative
Keywords
Wire bond AOI, Wafer AOI, X-ray software
Website
13 Kaki Bukit Road 1
#01-05 Eunos Technolink
Singapore
415928