This year’s theme is Scaling Challenges: The Future of Materials and Packaging.
Traditional device scaling has become a challenging technical problem that is accepted by an ever smaller group of companies. Process and device architecture innovations continue to deliver device density improvements, but are threatening to slow the pace of scaling, and come at prices that risk upsetting the continued reduction of silicon transistor costs with each node.
Productivity gains, process improvements, and materials innovation have mitigated scaling costs, and are now being combined with novel device packaging approaches to offer continued functionality to users in all market segments.
SMC 2016 will take a broad look at what is driving the demand for new materials and how material suppliers are being impacted by the value chain it serves and how this affects scaling challenges for the future of Materals and Packaging. SMC is also a great way to network with Industry leaders in the Microelectronics Ecosystem.
2016 Keynote Speakers:
Dr. John Hu
Ingrid Y. Shi
Dr. Anton DeVilliers
Highlights from 2015
SMC 2015 Participating Companies
SMC has provided valuable information and networking opportunities to materials and electronics industry professionals since 1995.
SMC 2015 builds on that legacy, expanding the reach and focus of the conference to examine advanced electronics materials for the semiconductor and adjacent industries.
Tuesday and Wednesday
Computer History Museum
Reception & Lanyards Sponsor:
Coffee Break Sponsors:
Sponsorship opportunities for this event are available. To become a sponsor, contact Shane Poblete at