Strategic Materials Conference - SMC 2015 Agenda
Agenda in PDF
Tuesday, September 22
|7:30am-8:30am||Continental Breakfast / Registration- Sponsor:|
|8:35am-8:40am ||Opening Remarks|
Director, Strategic Marketing and Collaborations
Air Products and Chemicals
Co-Chair, SMC 2015 Committee
|8:40am-9:20am||Opening Keynote |
|9:20am-9:50am||Title of Presentation: TBD|
Mark Thirsk (Biography)
|9:50am-10:20am||Networking Break- Sponsor:|
| ECONOMIC / MATERIAL TRENDS- Sponsor:|
|Session abstract - Market
forces that drive demand for semiconductor process materials not only involves
the influence / demand from chip fabricators, but also involves end use
applications, largely influenced by consumer demand, locally and globally. The first day of the Strategic Materials
Conference will feature, the Economic and Market Trends Session. Here, the semiconductor business environment
will be presented from various vantage points - from the materials perspective
through chip fabricator, to the global economic view point. Information on materials and business trends
for a broad range of semiconductor device technologies, and the driving forces
behind these trends, will be presented in the form of four key
presentations. Market experts will
present their findings on market trends in materials and semi equipment growth,
semiconductor production demand, and end user applications. In addition, a “street perspective” and
global economic influences on the semi market will be presented, connecting the
semiconductor market to Wall Street, and to the world. |
|10:50am-11:20am||Title of Presentation: TBD|
Mehdi Hosseini (Biography)
Sr. Equity Research Analyst
Susquehanna International Group
|11:20am-11:50am||Title of Presentation: TBD|
Dan Tracy (Biography)
Senior Director, Industry Research
Title of Presentation: TBD
|MATERIAL ENABLING SILICON EVERYWHERE- Sponsor:|
New life for old technologies, and new capabilities from materials science.
The Electronics industry is rolling out a family of new devices and systems to support the Internet of Things. Critical to this vision is the interconnection of tens or hundreds of billions of systems that will supply information for analysis and action. Common examples of such systems are sensors measuring and reporting out data on our health, our cars, houses, cities, workplaces, and the global environment.
These devices will combine existing and novel capabilities such as new types of sensors, low-power operation, energy harvesting, and interconnectivity to mobile or fixed wire communications. Many of these devices will build off well-known technologies, but “More than Moore” integration will likely be necessary to fulfil the vision.
This session of SMC 2015 will review the process material requirements and device manufacturing implications of distributing IC-based devices to all aspects of our lives.
Title of Presentation: TBD
|2:30pm-3:00pm||Networking Break- Sponsor:|
|Wednesday, September 23|
NEW EMERGING MATERIALS TECHNOLOGY & OPPORTUNITIES AT THE EDGE- Sponsor: Linde Group
Session abstract: In 2015, we stand at the threshold of an era that will be defined by ‘hyper-connectivity’. The relentless pursuit of ever-increasing functionality with ever-decreasing unit production costs have already enabled the widespread adoption of cloud computing, digital inventory control and tracking, real-time feedback control of automated manufacturing operations, and has revolutionized the way that entertainment content is sold, consumed and archived.
Though the first microprocessor was commercialized in 1971 (Intel 4004, 4-bit), Ethernet developed at Xerox a few years later (1973-1974), and the first automated mobile cellular network launched in 1979 (NTT), to a great extent computing was constrained to localized data access/transmission sites for nearly 20 years. During this time, entire industries arose to feed the insatiable demand for information, and the processing of that information to improve productivity and quality-of-life.
In retrospect, a major inflection point occurred in 1997 with standardization of the WiFi 802.11 wireless data protocol. The ‘Great Untethering’ of data from wired infrastructure lead to an explosion in lightweight, high-powered, energy efficient portable computing and today we stand at the point where virtually every free human on the planet will find it possible to be in contact with any other at essentially the speed of light. Though this capability remains a novelty to many, the children of today’s generations will grow up with this functionality as a given. This session of SMC2015 is structured to explore how this ubiquitous connectivity will enable new modes of work and leisure, healthcare and entertainment, production, distribution and consumption of the staples and ornaments of life.
Where the previous sessions in this year’s conference included ways in which existing materials and manufacturing technologies may be ‘repurposed’ for new applications, the speakers in this session will highlight the new-to-the-world capabilities we foresee over the next 20 years, and some likely areas where materials science and technology will be essential parts of tomorrow’s digital ecosystems.
|7:30am-8:30am||Continental Breakfast- Sponsor:|
Director, Business Strategy and Planning
SMC 2015 Co-Chair
|9:05am-9:35am||Florian Gstrein (Biography)|
Manager of Novel Materials Group, Components Research
Ralph Dammel (Biography)
Andrew Grenville (Biography)
|10:35am-11:00am||Networking Break- Sponsor:|
|11:00am-11:30am||Speaker 5- TBD|
|11:30am-12:00pm||Speaker 6- TBD|
|12:00pm-12:30pm||Speaker 7- TBD|
|ADVANCED INTERCONNECT TECHNOLOGIES|
The Advanced Interconnect Session of the 2015 Strategic Materials Conference will examine the challenges that await BEOL interconnects for scaling at 7nm and beyond. The need for new materials that meet conductivity and electrical permittivity requirements within the BEOL must be balanced against what can realistically be packaged and meet the operational performance in servers, mobile devices and other products that are incorporating advanced computational capabilities. Furthermore, because of the move to more intimate interconnectivity between the CPU, memory, sensors and output devices, rapid and reliable movement of information must also be addressed. This session will address many of these issues from perspectives that range from what is being evaluated on today’s roadmaps, the pervasiveness of 3D interconnectivity, to out-of-the-box approaches such as optical computing and the adoption of graphene for wiring.
|1:40pm-2:10pm||Title of Presentation: Alternative Metals for Advanced Interconnects|
Christoph Adelmann, PhD (Biography)
Principal Scientist, Thin Films
|2:10pm-2:40pm||Speaker 8- TBD|
|2:40pm-3:10pm||Speaker 9- TBD|
|A VIEW FROM THE FABS - PANEL DISCUSSION|
The panel discussion “A View From the Fabs” will address the current and emerging trends for electronic materials from the perspective of the semiconductor and MEMS manufacturers focused on making devices that enable the growing “Internet of Things”. Participants on the panel will be asked to present a ten minute commentary on the issues related to materials these companies are facing in meeting the expectations of their customers, who are responsible for fabricating and marketing the devices used for example in such applications as smartphones, autos, appliances, wearable and security monitoring. Topics that are encouraged for discussion include new material needs, supply chain challenges, and how to build collaborative relationships that result in a win-win for both the device manufacturer and the supplier community. Following the presentations will be a moderated Q&A session with the audience to further explore these topics as well as issues that may subsequently rise during the open dialogue.
|3:40pm-3:50pm||Speaker 10- TBD|
|3:50pm-4:00pm||Speaker 11- TBD|
|4:00pm-4:10pm||Speaker 12- TBD|
EXECUTIVE PANEL DISCUSSION
Agenda as of April 17, 2015. Subject to change.
Go back to http://www.semi.org/smc
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