COSEI Technology Co., Ltd.
Feb 1, 2017
271227
Small Automatic Grinding/Polishing MachineGrinding Width: 76~170mmSpeed: up to 5m/minMachining Examples: Ceramic substrate, Glass substrate, Molding substrate, QFN de-flash, Pre-mold lead frame, Alumium substrate, etc.Automatic adjusted pressureUPH>100 pcs
Primary Industry
Semiconductor
Primary Product Category
Equipment and Sub-Systems
Primary Product Sub Category
Substrate Conditioning
No.146-5, Neiding 2nd St., Zhongli Dist.,
Taoyuan City
320