Fraunhofer IZM
Oct 22, 2015
10253
Fraunhofer IZM develops assembly and interconnection technology, also known as electronic packaging. Almost invisible and undervalued by many, electronic packaging is the heart of every electronic application. Our technologies connect the individual components, protect the components and devices from vibration and moisture, and reliably dissipate heat.
Primary Industry
Semiconductor
Primary Product Category
Services
Primary Product Sub Category
Research Institutes
Website
Gustav-Meyer-Allee 25
Berlin
D-13355