Welcome to the SEMI Quarterly Report to Members:|
Documentation of SEMI accomplishments for Q2 of 2012 (April through June)
This Quarterly Report to Members features SEMI accomplishments and key activities for the period April-June 2012. First, I would like to give you a quick summary of my comments to members at the annual SEMI Membership Breakfast held in July at SEMICON West.
Once a year, we provide the treasurer's report for our most recent fiscal year and summarize the results of the SEMI Board elections, including the selection of our chairman and vice chairman for the coming year.|
During the annual SEMI Membership meeting, I informed members that the essential measures of financial health, membership, and member services for their association were healthy and on-plan. SEMI finances in 2011 and into 2012 have continued to rebound from
the industry and economics downturn. While considerable challenges remain, successful SEMICON Korea, SEMICON China and SEMICON West exhibitions in the first half of this year give us confidence that we will meet our financial plan again for 2012. Also, SEMI membership has increased 4% from the same time last year, now reaching 1,936.
SEMI Standards also had an outstanding year with key milestones achieved in PV, 3D-IC and 450mm standards, and new standards committees were established in LEDs and in China. SEMI's growth in PV and emerging markets continued to advance in 2011.
Currently, approximately 19% of the association's revenues are derived from expositions, dues and programs serving solar and emerging markets.
Perhaps the most important key indicator of your association's health is the quality of leadership that serves on the SEMI Board of Directors. This year, we announced the results of your annual Board of Directors elections. Jifan Gao, chairman and CEO of Trina
Solar (China), Nobu Koshiba, president of JSR Corp (Japan), Sue Lin, vice chairman of Hermes-Epitek (Taiwan), and Natsunosuke Yago, president of Ebara Corp. (Japan), were named as new directors to the board. Douglas A. Neugold, chairman, CEO and president of ATMI, Inc.
(U.S.), will continue to serve as SEMI chairman and André-Jacques Auberton-Hervé, president, CEO and chairman of the Board of Soitec Group (France), will continue in the position of vice-chairman of the board. Yong Han Lee, chairman of Wonik (Korea), was elected to the
position of second vice chair.
I am extremely confident that this strong Board of industry leaders from around the world, representing all key sectors of the microelectronics industry, will continue to provide the leadership that assures you of a healthy, effective and valuable
association that is focused on member needs.
The following sections of this Quarterly Report to Members will provide you more details on the results achieved by your association during the second quarter of this year.
President and CEO
Quarter 2 (Apr-Jun 2012) Global SEMI Accomplishments
SEMI Foundation/High Tech U
- In May, students from Longview, Washington high schools attended a three-day High Tech U program sponsored by CEDC, EcoTech Recycling, Weyerhauser, and others. Students participated in hands-on activities, including chemistry and statistics modules. On the last day, they did mock interviews with industry professionals.
- In June, STMicroelectronics, Soitec and INP Grenoble in Grenoble, France sponsored and hosted their ninth program. Forty local secondary students attended the three-day program where they learned about careers in high tech.
- In June, the SEMI Foundation held reunions in Hillsboro, Oregon (hosted by FEI Company) and in San Jose, California (hosted by SEMI). The two programs were sponsored by Applied Materials, City of Hillsboro, Intel,
KLA-Tencor, Lam, SolarWorld and Ultratech. Students learned about internship opportunities and tested the new Engineering Design module created by MATEC.
The Semiconductor Report (for Quarter 2)|
By Jonathan Davis, president, SEMI Semiconductor Business Unit
The market sentiment at the recent SEMICON West in San Francisco was decidedly positive. In spite of some macroeconomic uncertainty and policy ambiguities, an industry-wide outlook prevailed for growth in 2013 and 2014. It was also apparent that many challenges abound. The industry is consolidating. Technical challenges are increasing. Geometric scaling and Moore's Law now must be accomplished with rising process engineering complexity -- particularly in the areas of EUV lithography, 3D-IC chip packages and 450mm wafers. At SEMICON West, these and other tough issues were addressed. More details on SEMICON West will be covered in our Q3 report.
As for results in the immediate past quarter, SEMI continued to drive member value through a variety of topical events and important services. We are proud of the many accomplishments listed below that SEMI staff and a legion of member volunteers, participants and committee members helped bring to fruition. Among the Q2 endeavors are two that I'd like to highlight -- advocacy and technology.
Advocacy: In April, the 6th SEMI Brussels Forum took place, attracting top-tier government leaders and industry professionals. Industry leaders and EU representatives discussed recommendations on Europe's Key Enabling Technologies (KETs), to address the needs of the European semiconductor and PV industries. Over 200 participants from 29 countries attended. In the U.S., SEMI hosted its annual Washington Forum in May with 24 executives from SEMI member companies attending 20 meetings with members of Congress and other officials to push for top policy priorities in IP, Solar PV, and 450mm transition. In addition, SEMI released its worldwide IP Survey results. For over 60% of companies, IP challenges result in an adverse impact on their companies. This data and narrative drives an on-going dialog -- with policy makers, customers and supply chain participants -- on the critical need to respect and strengthen IP protections, which are the lifeblood of innovation.
Technology: Our technical conferences this quarter tackled tough questions about wafer size, node scaling and new transistor technology, and 3D-IC. The IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC) took place in May in Saratoga Springs, New York, addressing all of these issues. On April 24, SEMI Europe hosted a workshop in Grenoble "Beyond 300mm: Packaging Challenges and Opportunities for 450mm Wafers and Panel Scale Solutions" which offered perspectives on the complex wafer-size transition issues facing the semiconductor industry. In China, SEMI held an "IC Design/ Manufacturing for Mobile Internet Technology Forum" on June 28 in Beijing, attracting over 200 professionals from China IC design and manufacturing industry.
SEMI again fulfilled its objective to advance the dialog, convey vital information to our attendees, and serve as a catalyst for productive collaboration. As we work with partners, advisory committees, and governments around the world, we strive to help you find opportunities to expand your business in every region of the world.
Please read the summaries below for more detailed information. If you have questions or comments on how SEMI can better meet your needs, please contact me at email@example.com.
Quarter 2 (Apr-Jun 2012) Semiconductor Accomplishments
IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC) 2012
The 23rd Annual SEMI/IEEE Advanced Semiconductor Manufacturing Conference (ASMC) was held in May 15-17 in Saratoga Springs, NY. The conference featured over 60 technical presentations, with speakers from Applied Materials, ASML, GlobalFoundries, IBM, Qualcomm, SEMATECH, and VLSI Research.
6th SEMI Brussels Forum
This year's SEMI Brussels Forum took place on May 22 in Brussels, Belgium. The forum attracted over 200 decision makers,
key stakeholders from the European semiconductor industry, and representatives from the political arena. With the European Commission's Key Enabling Technologies (KET)
recommendations now published, work focused on implementation.
SEMI Hosts Annual Washington Forum
SEMI hosted its annual Washington Forum on May 8-9. Participants met with members of Congress, their staffs, and Federal
Government officials to push for top policy priorities on Intellectual Property, Solar PV, and the 450mm transition. Twenty-four executives from SEMI member companies attended 20 meetings on specific issues. The 2012 SEMI Government Leadership Award was presented to the chairman of the committee on Ways and Means, Rep. Dave Camp (R-MI).
SEMI China Holds IC Design/Manufacturing Forum
The one-day IC Design/Manufacturing was held on June 28 in Beijing, attracting over 200 professionals from the China IC design and
manufacturing industry. This event was supported by the Beijing Municipal Commission of Economy and Information Technology, BSIA, and the Beijing IC Design Park.
SEMICON Singapore was held on April 24-26 in Marina Bay Sands with 210 booths, 114 exhibitors, 6,439 verified visitors and
1,396 program attendees. There were many "firsts" too -- Korea Pavilion, OEM Sourcing Program, 3D-IC Gallery, and Singapore Small & Medium-size Companies Gallery. The 2.5D/3D-IC Forum
attracted 274 participants.
SEMICON Russia took place from May 15-16 in Moscow. Total attendance (visitors and exhibitors) was 2,739, an increase compared to last year. Over 80% of the visitors are directly involved in buying decisions. Program highlights were the Microelectronics Conference, PV Market session, and LED market session. The conference sessions featured 60 speakers attracting over 200 industry experts.
Korea: Semiconductor Processing and Packaging Technology Tutorials
The Semiconductor Processing Technology Tutorial was held on May 8-11. This year, 141 attendees attended the basic
course and 124 attendees attended the intermediate course. The attendees learned manufacturing processes from both engineers at chip makers and engineering school professors. In cooperation with Seoul Technopark, the hands-on Semiconductor Packaging Technology Tutorial course was held for the first time on June 28 with 20 attendees. The lecture version of this course was also held on June 29 at Kangnam University with 115 attendees.
Beyond 300mm Workshop
On April 24, SEMI Europe hosted a workshop in Grenoble "Beyond 300mm: Packaging Challenges and Opportunities for 450mm Wafers
and Panel Scale Solutions" which offered perspectives on the complex wafer-size transition issues facing the semiconductor industry. The workshop covered the core topics of packaging of
450mm wafers and panel scale solutions. Over 50 experts and decision makers from international companies participated in the first edition of this initiative.
Europe Networking Breakfast
In Rousset, France on May 24, member companies met in STMicroelectronics facilities (the most advanced 8" fab at STMicroelectronics)
for half a day. Information about SEMI PV activities was shared with members of PV Group, CTM, ITRPV, Standards, and InterSolar EU). Many attendees participated in networking opportunities.
Taiwan Member CEO Breakfast Meeting
A member CEO Breakfast Meeting was co-organized by SEMI Taiwan and PwC in April in Hsinchu. Erix Yu, corporate VP of Applied Materials was invited to share his observations on the challenges and opportunities facing Taiwan equipment makers. The meeting was attended by 15 executives from member companies and government
SEMI Intellectual Property Survey Released
SEMI released the results of its 2012 IP survey update. The survey was sent to a global group of SEMI members and almost half responded. Over 60% of companies reported that IP challenges have translated into an adverse impact on their companies. Three-fourths of the companies responding had pursued legal action against IP violators. In terms of the types of violations experienced, several areas were repeatedly mentioned -- patent infringement and counterfeiting.
Singapore Workforce Development
To further the growth of the future industry workforce, SEMI Singapore signed a Memorandum of Understanding
(MoU) with Republic Polytechnic during the VIP Dinner held at SEMICON Singapore 2012. Under the cooperative agreement, students can participate in the SEMICON University program where they learn the latest technology developments in the semiconductor industry and learn from industry mentors. SEMI will also help RP secure internship opportunities with local and global leading companies.
"Future of Electronics Innovation" Video Competition Winner Announced
Winners of the inaugural YouTube video competition for the "Young Talent Outreach Program" were announced in a ceremony held during SEMICON Singapore in April. Students produced videos on the theme "Future of Electronics Innovation." Ten schools and 25 teams participated in the video competition. Prizes were sponsored by 20 leading companies in the industry. Winning teams were also invited to "Breakfast with CEO" sessions with top executives from Infineon Technologies, SSMC, Siltronic-Samsung Wafer and Soitec.
Webinar: European Microelectronics Fab Outlook 2012
On June 25, the "European Microelectronics Fab Outlook"occured, which discussed European fabs, products, technologies, manufacturing facilities and financial information.
The presentation included 316 locations in 32 countries, focused on microelectronics. Presenters included SEMI's Dan Tracy and Beat Mueller, and Yole Developpement's Jean-Christophe.
IC Quality Committee in Taiwan
Echoing the industry needs for improving communication among supply chain in quality alignment, SEMI Taiwan formed the IC Quality Committee in May. The committee is supported by IC design companies from AMD, nVIDIA, STMicroelectronics and co-chaired by TSMC and ASE. Three task forces/topics were identified to improve the critical IC quality management issues: Spec. Alignment among Supply Chain: Visual Defect; (led by TSMC); Green Product Requirements (led by STMicroelectronics; and Wafer Lifetime (led by KYEC).
Americas Regional Events
- SEMI Northeast Forum 450mm Update (Albany, NY; April 4): Over 80 industry professionals attended the event hosted by the College of Nanoscale Science and Engineering (CNSE).
- Silicon Valley Lunch Forum (Santa Clara, CA; April 19): With the topic "Manufacturing For Mobile Solutions: The Impact of Mobile Devices on Supply Chain Dynamics."
- SEMI Arizona Breakfast Forum (Intel, Chandler, AZ; April 24): Intel and Applied Materials presented an Overview of 450mm Highlights, Challenges, and Outlook.
- SEMI Pacific Northwest Breakfast Forum (Lake Oswego, OR; May 1): Applied Materials and Intel presented their views of the transition to 450mm.
- SEMI Austin Breakfast Forum (Austin, TX; May 9): Entitled "Securing Austin's Semiconductor Future."
- SEMI Northeast Forum (Chelmsford, MA; June 6): At the "Annual Semiconductor Market Trend Update," speakers included those from Gartner Dataquest, IC Insights, and IHS iSuppli.
International Standards Update for Semiconductors
- 450mm: To assist members involved in supplying equipment, materials, and fab services for 450mm wafer manufacturing, SEMI created a "450mm EHS" interest group. The interest group will provide a platform to discuss EHS-related business impacts of 450mm wafer manufacturing.
- SESHA: SEMI EHS partnered with SESHA for the Annual International High Technology ESH Symposium and Exhibition on April 9–13 in San Jose, CA. SEMI staff played a significant role in organizing technical sessions, including the Sustainability Roundtable featuring speakers from Applied Materials, Intel, Global Foundries and Dow. SEMI members received a discount on registration.
- WSC Partnership: Shanghai, China
Under the auspices of the World Semiconductor Council, CSIA convened the global International High Technology ESH Conference between May 9–11 in Shanghai, China. SEMI members were provided a discount for reduced-price registration.
New 450mm Standard
The new standard "SEMI G92-0412, Specification for Tape Frame Cassette for 450 mm Wafer" specifies mechanical features for the 450mm wafer tape frame cassette used between the wafer mounting process and the die-bonding process. The Assembly and Packaging Committee is now developing another Standard for the load port interface between the frame cassette and processing equipment (Document 4965C, New Standard for Mechanical Interface Specification for 450 mm Load Port for Tape Frame Cassettes in the Backend Process).
Other Wafer Processing (300mm/450mm) Standards Update
3D-IC Standards Update
- Silicon Wafer: SEMI M1 (Specification for Polished Single Crystal Silicon Wafers) revisions approved: Ballot 5251 (To include Specification for 300 & 450mm Diameter Silicon Wafers for 32, 22, and 16nm Technology Generations) and Ballot 5376 (to revise references to DIN Standards).
- Facilities: SEMI F47-0706, Specification for Semiconductor Processing Equipment Voltage Sag Immunity, was reapproved.
- Compound Semiconductor Materials: Published New Standard, SEMI M82, Test Method for the Carbon Acceptor Concentration in Semi-Insulating Gallium Arsenide Single Crystals by Infrared Absorption Spectroscopy; and Test Method for Determination of Dislocation Etch Pit Density in Monocrystals of III-V Compound Semiconductors. The committee also approved line item revisions to SEMI M75, Specifications for Polished Monocrystalline Gallium Antimonide Wafers.
- Information & Control (Equipment Automation Software): Published New Standard, SEMI E164, Specification for EDA Common Metadata: Common approaches for defining specific elements of equipment metadata; metadata representation of selected SEMI communication standards, including those widely used in 300 mm semiconductor factories.
- Liquid Chemicals: Published New Standard, SEMI F110: Test Method for Mono-dispersed Polystyrene Latex (PSL) Challenge of Liquid Filters. This document provides a test method for the mono-dispersed polystyrene latex (PSL) challenging of liquid filters.
EHS Standards Update
- New Activities: Guide for Metrology for Measuring Thickness,Total Thickness Variation (TTV), Bow, Warp/Sori, and Flatness of Bonded Wafer Stacks; Guide for Metrology Techniques to be used in Measurement of Geometrical Parameters of Through-Silicon Vias (TSVs) in 3DS-IC Structures.
Energy Saving Equipment Task Force Formed
- Revised SEMI S8: S8, Safety Guidelines for Ergonomics Engineering of Semiconductor Manufacturing Equipment, was revised, in particular: revisions related to Whole Body Clearances; Hand and Arm Clearances; Maintenance and Service; and Control Locations.
- Published New Standard, SEMI S29: Guide for F-GHG (Fluorinated Greenhouse Gas) Emission Characterization and Reduction. This document provides guidance to characterize fluorinated greenhouse gas emitted from manufacturing equipment and F-GHG destruction or removal efficiency (DRE) of an abatement tool. This document also addresses continuous improvement planning for emission reduction on ME or an abatement tool.
- Seismic Protection Task Force Formed: Approved by the Taiwan EHS committee; initial discussion will focus on SEMI S2 (Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment) and SEMI S26 (Environmental, Health, and Safety Guideline for FPD Manufacturing Systems).
The Energy Saving Equipment Task Force, chartered under the Information & Control Committee, will focus on communication protocol and message content between the factory system and production equipment for the purpose of enabling, confirming, and monitoring sleep modes for reducing energy consumption on production equipment and support systems.
Standards Programs and Training
SEMI Industry Research and Statistics
- SEMI Taiwan 3DS-IC Standards Training: Co-organized with ITRI, SEMI Taiwan 3DS-IC Standards training was held on May 8. Speakers from SEMATECH and SEMI headquarters shared the latest developments in 3D-IC standards with 70 attendees.
- SEMI Korea Standards Technical Educational Program (STEP): Two STEPs were held in Q2. SEMI Korea provided GEM/SECS (Generic Equipment Model/SEMI Equipment Communication Standard) STEP on May 25 with Samsung SDS employees and SEMI F47 (Specification for Semiconductor Processing Equipment Voltage Sag Immunity) STEP on May 31 with the Korean Standards Association (KSA).
- SEMI Singapore Standards Introduction SEMI Singapore introduced the SEMI Standards International Program at SEMICON Singapore on April 25 with a two-hour program for 22 attendees
- Book-to-Bill: March 2012: US$1.29 billion in orders; book-to-bill of 1.12 (final); April 2012: $1.46 in orders; book-to-bill of 1.10 (final); May 2012: $1.54 billion in orders; book-to-bill of 1.05 (final); June 2012 $1.46 billion in orders; book-to-bill of 0.94 (prelim).
- Semiconductor Equipment: SEMI projects semiconductor equipment sales will reach $42.4 billion in 2012 according to the mid-year edition of the SEMI Capital Equipment Forecast. The forecast indicates that, following a 9% market increase in 2011, the equipment market will contract by 2.6% in 2012.
- Semiconductor Materials: The global semiconductor materials market increased 7% in 2011 compared to 2010, with record revenues in 2011 of $47.86 billion, surpassing 2010's record revenues of $44.85. The third highest revenue on record was in 2007 when revenue was $42.67 billion.
- Worldwide Silicon: According to the SEMI Silicon Manufacturers Group (SMG), total silicon wafer area shipments were 2,033 million square inches during Q1, a 1% increase from the 2,009 million sq. in. shipped during the previous quarter.
The Photovoltaics Report (for Quarter 2)|
By Bettina Weiss, VP, SEMI PV Business Unit
"When will there be good news?" This question is reverberating louder and louder through the global PV manufacturing industry in a
variety of languages. Hardly a week goes by without news of foreclosures, insolvencies, or significant project delays. The global
PV equipment book-to-bill ratio hovers around 0.40. It's just plain bad. And the solar winter is likely to continue for a while.
Overcapacity is still about 2X of demand. It's going to take some time for the market to absorb this excess capacity and for
cell makers to start manufacturing again. GTM Research reported that about 21GW of capacity will be retired by 2015 due to consolidation,
attrition and downramping. And the U.S.-China trade dispute is heating up.
The combination of all these difficult circumstances presents a big challenge to all companies in the manufacturing supply chain.
We at SEMI work hard to help our members through these trying times. We are exploring opportunities to provide more value through new and extended partnerships
in market research, for example. The CIPTC conference during SOLARCON China in March gave attendees rich content on technology, markets, policy and roadmaps--as well as
some tips for the inevitable upturn. Our PV Standards activities worldwide have resulted in 38 published PV Standards to date, with about 30 additional new standards under development, further
contributing to overall manufacturing cost reduction and global adoption of best practices. We have successfully launched the globalization of the International Technology Roadmap for PV (ITRPV) and the PV Manufacturing Consortium
(PVMC) activity on creating a U.S. CIGS technology roadmap is picking up momentum.
Last, but certainly not least, despite the gloom and doom, SEMI's PV Production & Technology Hall at Intersolar Europe 2012 in Munich was busy, and feedback from exhibitors and visitors was
positive and often upbeat. We all know the upturn will happen, and we hope for sooner rather than later. But we will look back on this time knowing that the industry will be stronger and better positioned to
keep the promise of seeing solar energy ubiquitously deployed around the world.
Quarter 2 (Apr-Jun 2012) Photovoltaic Accomplishments
PV Production and Technology Hall at Intersolar Europe 2012
Munich, Germany (June 19-21) Intersolar Europe 2012 had an attendance of 66,000 visitors from more than 160 countries. The total exhibitor count was 1,909 from 49 different countries. The segment of PV production and technology, managed and operated by SEMI PV Group, showed a growth of 10% compared to last year. SEMI PV Group also had a booth in hall A6, informing stakeholders about the latest trends in PV manufacturing through various standards meetings and roadmap presentations.
8th Advanced PV Manufacturing Forum
The 8th Advanced PV Manufacturing Forum took place in Munich, Germany on June 19-21. PV technology leaders, managers, engineers and professionals from the manufacturer and supplier community, as well as for R&D, shared the most recent developments in their joint drive towards excellence in PV manufacturing. In addition, the forum offered networking. The feedback from the 14 speakers and 180 attendees was excellent.
SEMI Signs MOU with Solar Energy Industries Association (SEIA)
SEMI has signed a Memo of Understanding (MOU) with the Solar Energy Industries Association (SEIA). The agreement formalizes the relationship between the two
organizations in collaborating on a number of areas of mutual benefit for each association, and for the solar PV industry as a whole. Under the new partnership, SEIA and SEMI will collaborate on select communications
opportunities, events, policy, and market research activities that promote solar energy.
PV Executives Meet in Western China to Explore the PV Installation Market
Hosted by the deputy mayor of Yulin City, the SEMI China PV Advisory Committee event was held on May 29 in the Shanxi Province. Committee members from Astronergy, CNBM, Hans PV, JA Solar, Nuvosun, OCI, Oerlikon PV, Seven Star, Silevo Solar, Trina Solar and Wacker participated. Executives from more than 20 PV companies such as First Solar, Huanghe Photovoltaic and Goodwe also attended the event. This was the first SEMI event for member company executives in western China to explore the PV installation market after several years of advocacy for China PV FIT policy.
Commerce Department to Help Showcase U.S. Companies at SOLARCON India
The U.S. Department of Commerce has granted SOLARCON India 2012 Trade Fair Certification status, establishing a U.S. Pavilion that welcomes U.S. firms of all sizes. Trade Fair Certification affords U.S. exhibitors at SOLARCON India 2012 a full range of support services from the U.S. Commercial Service in the United States and India, including one-on-one export counseling.
Washington Forum 2012
SEMI hosted its annual Washington Forum on May 8-9. The event is hosted by SEMI's North American Advisory Board (NAAB), but also includes some members who are dedicated government affairs professionals. Over the course of two days, the participants met with Members of Congress, their staffs, and Federal Government officials to push for the top policy priorities. Four teams held 20 meetings to cover specific issue areas including Solar PV, Intellectual Property, and the 450mm transition.
PVSEC-23 to be Co-organized by SEMI in Taiwan in 2013
In 2013, PVSEC-23 will be co-organized by SEMI and TAITRA in Taipei. The program committee was formed in Q2 with support from academia and SEMI Taiwan PV Committee members. The detailed "Call for Papers," information will be announced in December 2012.
Europe Networking Breakfast
On May 24, SEMI member companies met in Rousset, France at STMicroelectronics facilities (the most advanced 8" fab at STMicroelectronics) for half a day.
Information about PV activities of SEMI was shared with members (PV Group, CTM, ITRPV, Standards, InterSolar EU). Networking opportunities were offered to attendees during the event, including the Speed Networking Session.
U.S. Anti-Dumping Policy Shared at PV Group Member Event in Taiwan
SEMI Taiwan invited AIT (American Institute in Taiwan) to update U.S. anti-dumping policy at its PV Group member event in May. A speaker from DAIWA Capital Markets provided insights and solutions from the financial perspective. A total of 165 people attended the seminar.
SEMI EHS Hosts Technical EHS Session at the World Renewable Energy Forum
The World Renewable Energy Forum (WREF) and the International Solar Energy Society (ISES) held a joint global conference on May 14-17 in Denver, CO.
SEMI staff played a significant role in organizing technical sessions focusing on EHS issues affecting the PV industry.
SEMI EHS Partners with SESHA for Annual EHS Symposium
SESHA held its Annual International High Technology ESH Symposium and Exhibition on April 9–13 in San Jose, CA. SEMI staff played a significant role in organizing technical programs, on issues affecting the PV industry. SEMI members received a registration discount.
SEMI International Standards Update for Photovoltaics
SEMI Industry Research and Statistics
- New Task Forces: Photovoltaic Standards Technology Committees met in China, Europe, Japan and the U.S. During the meetings, new Task Forces were formed: Metal Paste for Crystalline Silicon Solar Cells; Poly-Silicon Packaging Materials; PV Diffusion Furnace Test Methods; and PV Package Performance.
- New Standard*: Test Method for In-Line Measurement of Cracks in PV Silicon Wafers by Dark Field Infrared Imaging
- New Standard*: Test Method for In-Line Measurement of Saw Marks on PV Silicon Wafers by a Light Sectioning Technique Using Multiple Line Segments
- New Standard*: Test Method for In-Line, Non-Contact Measurement of Thickness and Thickness Variation of Silicon Wafers for PV Applications Using Capacitive Probes
- New Standard*: Test Method for Mechanical Vibration of c-Si PV cells in Shipping Environment
- Revision: SEMI PV17, Specification for Virgin Silicon Feedstock Materials for Photovoltaic Applications
- Revision: SEMI PV18, Guide for Specifying a Photovoltaic Connector Ribbon
- New Activities: In-Line Measurement of Lateral Dimensions of PV Silicon Wafers for PV applications; In-line characterization of PV Silicon Wafers by using photoluminescence; In-line characterization of PV Silicon Wafers regarding Grain Size; and Measurement of Defects in PV Silicon Wafers in PV Modules by Electroluminescence Imaging
*pending successful procedural review by the International Standards Committee Audits and Reviews Subcommittee
- Worldwide Photovoltaic Equipment Book-to-Bill: Worldwide photovoltaic manufacturing equipment billings declined for the third consecutive quarter, falling another 20% for the quarter and 60% from the same quarter
last year, according to the SEMI Worldwide Photovoltaic Equipment Market Statistics Report for Q1 2012. The reported total quarterly billings of $695 million declined to the lowest level since the start of the data collection program in Q1 2010.
The Emerging Markets Report (for Quarter 2)|
By Tom Morrow, EVP, Emerging Markets Business Unit and CMO, SEMI
The Emerging Market Business Unit mission is to help improve the growth and profitability of SEMI members in adjacent markets that utilize semiconductor processing technology,
equipment, materials, and solutions. Our strategy for accomplishing this is to extend existing SEMI services in events, public policy, standards, market data and other programs for
use by adjacent industries in LEDs, MEMS, displays and plastic electronics.
Accomplishments in the LED industry during the Q2 2012 demonstrate the effectiveness of this strategy. LED wafer factory and automation standards proceeded to ballot during the quarter;
the SEMI Opto/LED May update provided the industry's best estimate of capital spending and capacity growth by region and by individual fab; important changes were announced to import-export
regulations that benefitted SEMI members; and SEMICON events in Singapore and Russia brought key buyers and sellers together to advance business plans and the industry
Summarized below is additional information on these and other key accomplishments of the Emerging Market Business Unit for Q2 2012 (SEMCON West will be covered in the next Quarterly Report to Members).
Quarter 2 (Apr-Jun 2012) Emerging Markets Accomplishments
Global FPD Partners Conference (GFPC) 2012
In Himeji, Japan, from April 14-17, the three-day Global FPD Partner Conference included sessions and networking events designed to promote the development of business
relationships and foster discussion of shared business, manufacturing and technology issues affecting the growth of the global flat panel display industry. The event featured keynotes from Samsung Electronics, Sharp, and Japan Display and several
Display Taiwan 2012
Display Taiwan 2012 was held on June 19-11 with total 30,413 visitors in attendance and 204 exhibiting companies. The series of events featured Exhibitor Seminars, Procurement
Seminars and a Business & Technology Forum. In addition to bringing together the leading manufacturers, this year's pavilions including: Cross-Strait, Touch Panel, LCD Component, LCD Process Equipment, and 3D Display.
New Strategic Materials Conference
SEMI announced a reformatted 2012 SEMI Strategic Materials Conference (SMC), to be held on October 23-24 in San Jose, CA, focused on new materials and applications and featuring tracks on LED/Power and Organic Electronics.
High-Brightness LED Standards
Task Force meetings were held in April in North America.
Plastics Electronics Conference Committee Announcement
- Reballoted: Specifications for 100, 150mm Diameter Sapphire Wafers for HB-LED Applications were re-balloted in the Cycle 4 voting period (May 30–June 29). The initial ballot (in January 2012) received feedback that suggested several opportunities for improvement.
- Specifications: Specifications for Cassettes for 150mm Sapphire wafers were also submitted for the Cycle 4 voting period.
- SNARF: The Equipment Automation Task Force approved their first SNARF: (#5420) New Standard: Specification for Cassettes for 150mm Sapphire wafers used in HB-LED manufacturing.
The 8th Annual Plastics Electronics Conference (PE2012) -- co-located with SEMICON Europa -- announced a prestigious Conference Committee comprised of industry and academic leaders and
distributed a "Call for Papers."
SEMI LED Public Policy
SEMI public policy positions on LED manufacturing were a featured presentation before the U.S. Department of Energy Solid State Lighting R&D Manufacturing Conference in May.
New LED Advisory Committee in Japan
An LED Advisory Committee was established in Japan, joining LED Advisory Committees in China, Taiwan, Korea, and North America/Europe.
Brussels Forum Highlights LEDs, MEMS, PE as Key Enabling Technologies
Over 100 EU policy makers and SEMI members gathered for the 6th Annual Brussels Forum, advocating further support and implementation of the "Key Enabling Technologies" initiative which includes emerging technologies like high-brightness LEDs, MEMS, and Printed Electronics.
SEMICON Singapore MEMS and LED Events
Over 200 people attended the full-day MEMS Forum and half-day LED Forum at SEMICON Singapore. The exhibition featured LED and MEMS Pavilions providing products and services to regional MEMS
foundries, MEMS developers, and LED fabs.
SEMICON Russia: First LED Market Forum
SEMICON Russia featured the first LED Market Forum and TechArena for LED suppliers.
SEMI Taiwan LED Seminar 2012
Nearly 150 people attended SEMI Taiwan LED Seminar 2012 held in Hsinchu on May 24. This seminar focused on LED market trends and the latest technology developments with speakers from TSMC Solid State Lighting,
Edison Opto and ITRI/IEK.
SEMI Taiwan LED CEO Breakfast Meeting
B.J. Lee, chairman of Epistar, shared his insights on the challenges and opportunities of the LED industry development at the LED CEO Breakfast Forum -- which was co-organized by SEMI and PwC in Taiwan.
The event attracted 30 executives from member companies of SEMI and the Taiwan Lighting Fixture Export Association.
EHS Division Partners with WSC for Global EHS Conference in Shanghai
Under the auspices of the WSC, CSIA convened the global International High Technology ESH Conference on May 9–11 in Shanghai, China. SEMI staff played a role in organizing technical presentations focusing
on EHS issues affecting the LED industry.
FPD and Pan-Semiconductor Industry Gathering in Changzhou
On April 28, SEMI China held a Pan-semiconductor industry gathering in Changzhou, Jiangsu province, a city with fast-growing FPD, LED, and semiconductor industries. Over 60 industry leaders and government officials from growing
industrial regions such as Changzhou, Jintan, and Harbin attended. SEMI China shared the latest industry statistics with the participants, covering FPD, LED and PV. The event recently expanded to demonstrate SEMI China's commitment to building a strong China pan-semiconductor community.
Standards Update for Flat Panel Display
The FPD Metrology Committee in Taiwan reports:
SEMI Opto/LED Fab Forecast Predicts Slow Down
- Ballot issued: 4764 New Standard: Measurement Method of 3D Flat Panel Display with Active Glasses and 4765 New Standard: Measurement Method of 3D Flat Panel Display with Passive Glasses
- Published SEMI D68-0512, New Standard: Test Methods for Optical Properties of Electronic Paper Displays
Following a 60% capacity expansion in 2011, LED fab investments will slow down somewhat with expected capacity expansion of 39% and 26% in 2012 and 2013, respectively. Overall LED equipment investment may decline about 30% from $2.6 billion in 2011 to $1.8 billion this year. Spending in 2013 could see some small improvement over 2012.
Upcoming SEMI Events
For links and a full list of events, click here.
- Aug 24: Korea I&C Technical Committee (Seoul, Korea)
- Aug 28-29: Japan Committee Meetings: Micropatterning; Packaging (Tokyo, Japan)
- Aug 30: 15th Annual Silicon Valley Forecast Luncheon (Santa Clara, CA)
- Sept 3-5: SOLARCON India 2012 (Bangalore, India)
- Sept 5-7: SEMICON Taiwan 2012 (Taipei, Taiwan)
- Sept 5-7: Taiwan Standards Meetings (Taipei, Taiwan)
- Sept 6-7: SiP Global Summit 2012 (Taipei, Taiwan)
- Sept 6-7: Japan Committee Meetings: Trace/Phys Inter/Carriers (Tokyo, Japan)
- Sept 7: SEMICON Taiwan 2012 450 Supply Chain Forum (Taiwan, Taipei)
- Sept 11: SEMI Korea Members Day
- Sept 14: Japan PV Committee's Joint Meeting (Tokyo, Japan)
- Sept 19: SEMI Northeast Forum: Materials Matter/IC Manufacturing (Albany, NY)
- Sept 19-20: Japan Committee Meetings: Silicon Wafer/Metrics/I&C (Tokyo, Japan)
- Sept 20: SEMI Networking Day Italy (Milano, Italy)
- Sept 21: Japan Gases & Facilities Committee Meeting (Tokyo, Japan)
- Sept 25: Japan EHS Committee Meeting (Tokyo, Japan)
- Sept 27: SEMI Austin Gold Classic (Austin, TX)
- Oct 3-5: PV Taiwan 2012 (Taipei, Taiwan)
- Oct 8-11: SEMICON Europa Standards Meetings (Dresden, Germany)
- Oct 9-11: SEMICON Europa 2012 (Dresden, Germany)
- Oct 9-11: Plastic Electronics Exhibition & Conference 2012 (Dresden, Germany)
- Oct 11: SEMI Arizona Breakfast Forum (Chandler, AZ)
- Oct 19: Korea I&C Standards Technical Committee Meeting (Seoul, Korea)
- Oct 23-24: Strategic Materials Conference (SMC) 2012 (San Jose, CA)
- Oct 25: Japan Liquid Chemicals Committee Meeting (Tokyo, Japan)
- Oct 28-Nov 1: North America Standards Fall 2012 Meetings (San Jose, CA)
- Nov 2: Japan FPD Metrology Committee Meeting (Tokyo, Japan)
- Nov 2: Japan FPD Materials and Components Committee Meeting (Tokyo, Japan)
- Nov 4-7: Int'l Technology Partners Conference (ITPC) 2012 (Maui, Hawaii)
- Nov 8: SEMI Pacific Northwest Dinner Forum (Portland, OR)
- Dec 5-7: PV Japan 2012 (Chiba, Japan)
- Dec 5-7: SEMICON Japan (Chiba, Japan)
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