SEMI® Global Update ♦ January 2012
IN THIS ISSUE



Fearless into a "Doomsday" Year

Substrates for Semiconductor Packaging

LED Fab Equipment Spending to Decline 18% in 2012

Packaging Community Takes on New Challenges through Industry Collaboration

Printed Electronics Start to Show Up in Volume Hybrid Products

Large Screen OLED TVs Debut at CES

Official Establishment of SEMI China Photovoltaic Standards Committee


SEMI CALENDAR

ASIA

February 7-9
SEMICON Korea 2012

February 7-9
LED Korea 2012

February 8-9
Korea Standards Meetings

March 20-22
SEMICON China 2012

March 20-22
FPD China 2012

March 20-22
SOLARCON China 2012

EUROPE

February 26-28
ISS Europe 2012

March 25-27
PV Fab Managers Forum

March 27-28
Europe PV Standards Mtgs

NORTH AMERICA

January 15-18
Industry Strategy Symposium 2012

March 7
SEMI Northeast Forum: Wafers to Wall Street

Fearless into a "Doomsday" Year: Examining Fab Spending and Capacity into 2012 and Beyond
By Christian Dieseldorff, SEMI Industry Research & Statistics
The Mayan "Long Count" calendar marks the end of a 5,126-year era. According to some interpretations of the ancient Mayan calendar, the world is going to end on December 21, 2012. The worldwide economy and, therefore, the semiconductor industry depend more upon consumer sentiment and confidence. Will a new "fear factor" affect 2012?


Substrates for Semiconductor Packaging: 2012 Market Outlook for Laminate/Leadframe Materials
By Jan Vardaman, TechSearch International, and Dan Tracy, SEMI
Combined, laminate substrates and leadframes will represent an estimated US$ 13.3 billion market in 2011 and is forecasted to reach $14 billion in 2012.


LED Fab Equipment Spending to Decline 18% in 2012
Following a massive 36% increase in equipment spending in 2011 (up to US$ 2.42 billion), worldwide LED manufacturing equipment spending is projected to decline 18% in 2012 to $1.97 billion according to the latest SEMI Opto/LED FabWatch and Forecast. Worldwide LED manufacturing capacity is expected to reach two million wafers in 2012 (4" equivalent per month), a 27% increase over 2011.




Packaging Community Takes on New Challenges through Industry Collaboration
As the semiconductor industry responds to increasing demands for lower power, higher performance and reduced form factor, packaging technologies are increasingly important. This enhanced importance in the micro-electronics food chain is mirrored in a growth of the different segments of the packaging market.


Printed Electronics Start to Show Up in Volume Hybrid Products
By Paula Doe, SEMI Emerging Markets
Despite its huge potential for making low-cost large-area lighting, solar panels, and displays, printed electronics has struggled to find commercial applications. So far, it's been hard to match the cost or performance of vacuum deposition on wafers or glass.


Large Screen OLED TVs Debut at CES
Capital Spending Expected To Ramp to Meet Next Generation Display Technology

Large-size OLED displays from LG and Samsung are expected to debut at this year's Consumer Electronics Show in Las Vegas, ushering in what some predict will be major transformation of the LCD display industry. Merrill Lynch estimates OLED displays will grow from US$ 4 billion in 2011 to $20B in 2015 and as high as $35B in 2017.


Official Establishment of SEMI China Photovoltaic Standards Committee
During the SEMI International Standards Committee (ISC) meeting held at PVJapan 2011, formation of the SEMI China Photovoltaic Standards Committee was officially approved by the ISC.


MEMS Executive Congress

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