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Extending performance of lithography and photoresists to meet shrinking device requirements is challenged by film properties on levels such as polysilicon, aluminum, and copper. Patterning devices during lithography exposure is difficult due to the highly reflective nature of these films, varying photoresist thickness, and device topography. In order to minimize these effects, materials called anti-reflective coatings (ARC) are applied to wafers either immediately before or after photoresist coating.
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Keywords: Organic, Inorganic, Lithography, Market Research, Fabrication, Materials, Packaging, Investment, Forecast, CVD, Copper, Patterning, Photoresist