SEMI Industry Stategy Symposium (ISS) 2016: It’s All about Packaging – In this Material World That We Are Dealing With

Dan Tracy, Senior Director of Industry Research and Statistics at SEMI, discusses material supplier consolidation/restructuring, a packaging technology overview, material segment trends, challenges and disruptions, and a forecast. Mold compound consumption is declining, and die attach film selling price is declining (per squart meter). Application processor packaging trends, laminate substrates, and drivers for FO-WLP are also covered. Some supplier consolidation occurring yet new suppliers have emerged (especially in China). FO-WLP is a disruptive technology that will have a significant impact on the electronics industry and the consumption of semiconductor packaging materials in the coming years. From SEMI Industry Strategy Symposium (ISS) 2016 in January in Half Moon Bay, CA.

Keywords: Packaging, Materials, Forecast, Mobile, Copper, FO-WLP, Underfill, Substrate, Lamination, SiP, Die Attach, Packaging, Suppliers