SEMICON Taiwan 2017: High Throughput UV Projection Scanner with Optimized Performance for FOWLP Applications

Markus Arendt, President SUSS MicroTecPhotonic Systems, Inc. discusses market trends in advanced packaging, MEMS, LEDs, and more. The DSC300 Projection Scanner is introduced, which is tailored to address typical challenges of fan-out processes for WLPs; it is the lowest cost of operation UV exposure system in the market. In particular, its scanning technology, design flexibility, magnification correction, overlay improvement, beam-steering capabilities, exposeure performance, and depth-of-focus are showcased. From SEMICON Taiwan in September 2017 in Taipei.

Keywords: WLP, FO-WLP, Trends, Packaging, Advanced Packaging, MEMS, Sensors, Copper, LED, UV, Throughput