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Dan Tracy, Senior Director of Industry Research and Statistics at SEMI, discusses the very strong growth trends throughout 2017, including etch equipment surges due to 3D NAND and sub-20nm technology. Long-term forecasts (out to 2025) suggest growth driven by applications such as IoT, 5G, AR/VR, AI, and automotive. Packaging trends show that outsourcing packaging is becoming more common. Issues involving leadframes, mold compounds, and die attach are addressed. Many charts and graphs are supplied. From SEMICON Japan in December 2018 in Tokyo.

 

Keywords: 3D NAND, Trends, DRAM, Sensors, IoT, AI, Automotive, SSD, Fabrication, Materials, Copper, FO-WLP, SiP, OSAT, Die Attach