Strategic Materials Conference (SMC) Korea 2018: EUV Industrialization – High Volume Manufacturing with NXE:3400B

Roderik van Es, Director of Product Management EUV at ASML discusses the future of lithography: EUV, and its edge placement accuracy, patterning simplication/fidelity control, improvement in defectivity, and productivity >125 wafers per hour, allowing for lower cost operation. Team acknowledgements follow. From Strategic Materials Conference in May 2018 in Korea.

Keywords: EUV, Lithography, DRAM, Machine Learning