SEMI Europe

With fab operation optimization a critical part of the chip industry's challenge push to reach net zero emissions, the Fab Management Forum gathered industry experts to explore best practices for semiconductor manufacturers to follow.

No one could have left the 3D & Systems Summit 2023 – held in late June in Dresden – with any doubt that heterogeneous integration, enabled by increasingly mature 3D packaging technologies, is becoming a key enabler of the semiconductor industry’s success in the years to come.

As the global economy is constantly transformed, the need for new skills in the microelectronics industry has never been higher. To develop a workforce fit for the future, it is crucial to invest not only in reskilling and upskilling, but also in skills anticipation and inclusivity.

Dr. Franz Laermer, Research Fellow (Senior Chief Expert) at Robert Bosch GmbH Stuttgart, spoke about the latest trends in medical diagnostics and personalized treatments, and an open platform for the automation of complex molecular diagnostics workflows recently developed by Bosch.

SEMI spoke with Elisabeth Brandl, Business Development Manager at EV Group about trends and new developments within the power electronics industry and the devices' application in smart mobility. Brandl shared her views as part of the SEMI Technology Unites Global Summit, 15-19 February 2021.

SEMI spoke with Prof. Christoph Kutter, executive director, Fraunhofer EMFT, about trends and innovations in flexible hybrid electronics ahead of his presentation at the 2018 FLEX Europe - Be Flexible conference at SEMICON Europa 2018, 13-16, November 2018, in Munich, Germany.