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This collection contains presentations by Hiroyuki Ueno, of the R&D Department of SCREEN Holdings Co., Ltd., Val Marinov, CTO and Founder of Uniqarta, Inc., and J. Devin MacKenzie, Ph.D., CTO of Imprint Energy, Inc., which were given at the SEMICON West Conference in July 2016, in San Francisco, CA.
“SCREEN Multiple Approaches to Printed Electronics” discusses high resolution printing using flat stamp parallel printing (FSPP) and multiple depth plate for Gravure Offset printing. The process involves coating, patterning, and transferring, which results in high uniformity, small distortion, high resolution, and precise alignment. Test results are shown.
“The IC Side of the Flexible Hybrid Electronics Technology” compares flexible hybrid electronics and rigid/conformal electronics. Packaging platforms, IC assembly techniques, die assembly, and thin film interconnect technologies are also discussed. The true implementation of the FHE concept requires flexible, ultra-thin dies and innovative assembly technologies. The most feasible IC packaging format for FHE is the flip-chip bare die, adhesive bonded using anisotropic conductive adhesives. Bridging the ultra-thin die/printed substrate interconnection gap in FHE packaging requires flexible/stretchable interposers.
“University Research and Initiatives Towards Realizing a Viable Flexible Hybrid Electronics Technology” discusses continuous additive monolithic manufacturing of flexible electronics, as well as workforce development, sponsored research, and industrial/academic partnerships, centers, and user facilities for the advancement of FHE. The Nanomanufacturing Systems for Mobile Computing and Mobile Energy Technologies (NASCENT) Consortia is introduced, along with their work in nanosculpting, inkjet deposition, and nanometrology.
Keywords: Printed Electronics, Substrate, Packaging, FHE, Die Assembly, Thin Film, R2R, Lithography, IoT, Wearable Devices, Deposition, Patterning, Interconnects, Bonding, Additive Manufacturing, Metrology