2018FLEX Agenda

Agenda is subject to change. Please check back for updates.

Access the agenda by day: MONDAY, 2/12/18 | TUESDAY, 2/13/18 | WEDNESDAY, 2/14/18 | THURSDAY, 2/15/18

Concurrent Tech Events: FLEXTalk | STUDENT POSTERS

MONDAY, FEBRUARY 12, 2018 (COURSES & DISCUSSIONS)
		7:00 AM	REGISTRATION OPENS
		9:00 AM - 12:00 PM	SHORT COURSE 1: From Lab to Fab: Materials, Printing and Processing of Flexible Hybrid Electronics	Mark Poliks, Professor of Systems Science & Industrial Engineering, Technical Director of CAMM, Binghamton University James J. Watkins, Professor of Polymer Science & Engineering, Director of the Center for Hierarchical Manufacturing, NSEC, University of Massachusetts, Amherst Mike Mastropietro, Sr. Engineering Manager of Printing & Additive Processing, NextFlex
		1:00 PM - 4:00 PM	SHORT COURSE 2: Challenges and Solutions for Integration of Sensors with Flexible, Hybrid, Printed Systems	Chip Spangler, President, Aspen Microsystems Mary Ann Maher, CEO, SoftMEMS
		1:00 PM - 4:00 PM	SHORT COURSE 3: Flexible Device Integration & Packaging	Pradeep Lall, MacFarlane Endowed Professor of Mechanical Engineering, Director of Harsh Environment Node of NextFlex, Director of NSF-CAVE3 Electronics Research Center, Auburn University Douglas Hackler, President & CEO, American Semiconductor Kurt Christenson, Senior Scientist, Optomec
		1:00 PM - 4:00 PM	SHORT COURSE 4: Next Generation Flexible Displays	Paul Cain, Strategy Director, FlexEnable Mike Hack, VP of Business Development, Universal Displays Erica Montbach, Manager for R&D, Kent Displays D. Scott Bull, AVP of Research, E Ink
		4:00 PM - 5:30 PM	Applications Panel Discussion (Open to All)	Moderator: Malcolm Thompson, Executive Director, NextFlex Panelists: Nancy Stoffel, Horizontal Leader-Flexible Hybrid Electronics, GE Global Research Jeffrey Spindler, Director of Product Commercialization, OLEDWorks LLC Al Compaan, President & CTO, Lucintech Tatsuo Ogawa, Director, Manufacturing Technology & Engineering, Panasonic Wolfgang Juchmann, VP of Sales & Business Development, AutonomouStuff, Inc
		5:30 PM - 6:30 PM	WELCOME RECEPTION
TUESDAY, FEBRUARY 13, 2018
		7:00 AM	REGISTRATION OPENS & BREAKFAST - Sponsored by
1	A	8:00 AM - 9:45 AM	PLENARY 1: APPLICATIONS & MARKETS I
1.1	A	8:00 AM	2018FLEX Introduction & Welcome	Ajit Manocha President & CEO		SEMI
1.2	A	8:20 AM	Market Opportunity for Flexible Displays	Paul Gagnon Executive Director, Research and Analysis		IHS Markit
1.3	A	8:45 AM	Minimally Invasive Wireless Neural Interfaces	Rikky Muller Co-Founder & CTO		Cortera Neurotechnologies
1.4	A	9:10 AM	Market and Technology overview of Li-ion Battery	Tatsuo Ogawa Director, Manufacturing Technology & Engineering		Panasonic
1.5	A	9:35 AM	Sponsored by: FLEXI Awards Ceremony
		9:45 AM	MORNING BREAK - Sponsored by
2	A	10:45 AM - 12:25 PM	PLENARY 2: APPLICATIONS & MARKETS II
2.1	A	10:45 AM	In-Space Manufacturing: A Multimaterial Fab Lab for the International Space Station	Meyya Meyyappan Chief Scientist for Exploration Technology		NASA Ames Research Center
2.2	A	11:10 AM	Automotive Reality Head-Up Displays in the Era of Driverless Cars	Seth Coe Sullivan VP & CTO		Luminit
2.3	A	11:35 AM	Enabling Printed Power Electronics through Collaboration	Greg Fritz Materials Scientist		Draper
2.4	A	12:00 PM	Roll-to-Roll based Manufacturing Innovations to scale Printed Electronics to the Billion of Units enabling the Internet of Thing	Peter Fischer COO		Thin Film Electronics
		12:25 PM	LUNCH - Sponsored by
3	A	1:55 PM - 4:05 PM	SESSION 3: START-UP BUSINESS STRATEGIES
3.1	A	1:55 PM	TBA
3.2	A	2:15 PM	Innovation at Risk: The Industry Talent Challenge	Jonathan Davis VP of Global Advocacy		SEMI
3.3	A	2:35 PM	A Discussion with Oshri Kaplan: A Technology VC Perspective	Moderator: Melissa Grupen-Shemansky, CTO, SEMI-FlexTech Speaker: Oshri Kaplan, Partner, Silicon Foundry
3.4	A	3:05 PM	Panel Discussion: Identifying Opportunities for Small Businesses to Partner with the DoD in FHE Innovations	Moderator: Joseph Kunze, President & CEO, SI2 Technologies Panelists: Jason Jouet, Deputy Director, Manufacturing Technology, Office of Secretary of Defense Manufacturing & Industrial Base Policy James Zunino, Project Officer, Army Armament Research, Development, & Engineering Center Christian Whitchurch, Chief Scientist, Defense Threat Reduction Agency J9-CBA James Christensen, Airman Sensing & Assessment Portfolio Manager, Air Force Research Laboratory Airman Systems Directorate Kevin Kluska, Program Lead for Tailored Solutions, U.S. Government
		4:05 PM - 6:05 PM	NETWORKING RECEPTION
4	B	1:55 PM - 4:00 PM	SESSION 4: DISPLAYS
4.1	B	1:55 PM	Flexible Display Market Outlook, Challenges and Opportunities	Ross Young CEO		Display Supply Chain Consultants (DSCC)
4.2	B	2:20 PM	Organic Vapor Jet Printing: a Solvent-Less, Mask-Less Patterning Technology for OLED Displays	Mike Hack VP of Business Development		Universal Display Corporation
4.3	B	2:45 PM	ePaper 2.0– Enabling Applications Where Displays Haven’t Succeeded Before	Frank Christiaens Chairman & CEO		CLEARInk Displays
4.4	B	3:10 PM	Polyfluorinated Electrolyte for Fully Printed Carbon Nanotube Electronics	Huaping Li Chief Scientist		Atom Optoelectronics
4.5	B	3:35 PM	Next Generation Flexible eWriters - Transition from Research of New Technologies to Roll-to-Roll Manufacturing	Asad Khan CTO		Kent Displays
		4:00 PM - 6:00 PM	NETWORKING RECEPTION
WEDNESDAY, FEBRUARY 14, 2018
		7:00 AM	WOMEN IN TECH BREAKFAST
		7:00 AM	REGISTRATION OPENS & BREAKFAST - Sponsored by
5	A	8:00 AM - 9:25 AM	SESSION 5: HEALTH MONITORS
5.1	A	8:00 AM	Wearable Patch for Continuous Monitoring of Sweat Electrolytes	Azar Alizadeh Senior Material Scientist		GE Global Research
5.2	A	8:25 AM	Flexible Oral Biosensing Platform	David Schwartz Area Manager		PARC, a Xerox Company
5.3	A	8:45 AM	Graphene-based sensor for preventative diabetic healthcare	Linh Le CEO		Bonbouton
5.4	A	9:05 AM	Low-Power Wearable Sensors Enabled by Large-Area Flexible Organic Photodiodes	Canek Fuentes-Hernandez Senior Research Scientist		Georgia Institute of Technology
		9:25 AM	MORNING BREAK - Sponsored by
6	B	8:00 AM - 9:25 AM	SESSION 6: RF & SECURITY
6.1	B	8:00 AM	Operationalizing Printed Electronics & Additive Manufacturing to Enhance Warfighter Capabilities and Strengthen the Organic Industrial Base	James Zunino ARDEC AM Principal/Materials Engineer		US Army RDECOM-ARDEC
6.2	B	8:25 AM	Surface Agnostic Conformable Antenna Arrays	John Rogers Electrophysics Engineer		Boeing Research & Technology
6.3	B	8:45 AM	Copper Micro-Wires for RF Applications	Carolyn Ellinger Senior Research Scientist		Eastman Kodak Company
6.4	B	9:05 AM	Multiple-In Multiple-Out (MIMO) radar and printed energy-autonomous mm-wave backscatter retrodirective wireless nodes: The birth of the Internet of Skins (IoS)	Jimmy Hester PhD Candidate		Georgia Institute of Technology
		9:25 AM	MORNING BREAK - Sponsored by
7	A	10:25 AM - 11:50 AM	SESSION 7: HEALTH MONITORING SYSTEMS
7.1	A	10:25 AM	Flexible Hybrid Systems for the IOT	Janos Veres Program Manager		PARC, a Xerox Company
7.2	A	10:50 AM	Development of Flexible Biometric Sensor Band with Lifesave App and Test Protocols	Pradeep Lall MacFarlane Endowed Professor & Director		Auburn University
7.3	A	11:10 AM	Wearable Sensing Gloves for Objective Medical Assessments	Moran Amit Post-Doctoral Fellow		University of California, San Diego
7.4	A	11:30 AM	Design Considerations for Biomedical Applications Using Thin-Film Tactile Force Sensors	Rob Podoloff CTO		Tekscan, Inc
		11:50 AM	LUNCH - Sponsored by
8	B	10:25 AM - 11:50 AM	SESSION 8: DIRECT WRITE & 3D PRINTING I
8.1	B	10:25 AM	Toward the Fabrication of Electronic Circuits without using Surface Mounted Components	Yuan Gu Scientist		Laboratory for Physical Sciences
8.2	B	10:50 AM	3D Printing of Polymer-Bonded Magnets Using a Combination of Extrusion Direct Write and Stereolithography Methods	Callum Bailey Research Engineer		United Technologies Research Center
8.3	B	11:10 AM	Aerosol Jet Printed Carbon-Nanotube-Network Thin-Film-Transistors on Flexible Substrates	Jialuo Chen PhD Student		Georgia Institute of Technology
8.4	B	11:30 AM	Electromagnetic Shielding of Flexible Devices	Kurt Christenson Senior Scientist		Optomec
		11:50 AM	LUNCH - Sponsored by
9	A	1:30 PM - 2:55 PM	SESSION 9: FLEXIBLE ELECTRONICS APPLICATIONS I
9.1	A	1:30 PM	Complex Flexible Hybrid Electronic Labels	Douglas Hackler President & CEO		American Semiconductor
9.2	A	1:55 PM	FHE System for Touch and Gesture	Richard Ellinger VP of Sales & Marketing		American Semiconductor
9.3	A	2:15 PM	Energy Efficient Polymeric Window and Display	Josh Finch Project Engineer		New Visual Media Group, LLC
9.4	A	2:35 PM	The Flexible Electronics behind the Graftworx SmartPatch	Anthony Flannery VP of Engineering		Graftworx
		2:55 PM	AFTERNOON BREAK - Sponsored by
10	B	1:30 PM - 2:55 PM	SESSION 10: DIRECT WRITE & 3D PRINTING II
10.1	B	1:30 PM	Challenges and Opportunities for 3D Printed Electronics	Jan Vardaman President		TechSearch International, Inc.
10.2	B	1:55 PM	Inkjet printed multilayer circuit: materials and design considerations	Emmanuel Van Kerschaver Application Engineer		Meyer Burger Technical Systems (MBTS)
10.3	B	2:15 PM	Printed Electronics Using Magnetohydrodynamic Droplet Jetting of Molten Aluminum and Copper	Denis Cormier Earl W. Brinkman Professor, AMPrint Center Director		Rochester Institute of Technology
10.4	B	2:35 PM	Printed wireless sensor demonstration	Kenneth Church CEO		nScrypt, Inc.
		2:55 PM	AFTERNOON BREAK Sponsored by
11	A	3:55 PM - 5:40 PM	SESSION 11: FLEXIBLE ELECTRONICS APPLICATIONS II
11.1	A	3:55 PM	Perovskite solar cells on flexible glass	Maikel van Hest Senior Scientist		National Renewable Energy Laboratory
11.2	A	4:20 PM	All-solution-processed ferroelectric capacitors for flexible non-volatile memory applications: processing conditions and short circuits	Yanguang Zhang Research Officer		National Research Council Canada
11.3	A	4:40 PM	E -Textiles Fabricated via Inkjet Printing of Particle-Free Conductive Inks	Bill Babe Sales & Marketing Manager		Liquid X Printed Metals
11.4	A	5:00 PM	Inkjet-Printing of Optoelectronics Sensors	Martin Bolduc Senior Researcher		INO - National Optics Institute
11.5	A	5:20 PM	Potentials of System-in-Package Technologies for Future Bosch Products	Martin Giersbeck Vice President Plastics Engineering		Robert Bosch GmbH
12	B	3:55 PM - 5:40 PM	SESSION 12: FE TOOLS & METHODS
12.1	B	3:55 PM	Modular R2R Vacuum Coating System Platform for Pilot Scale Development and Production	Michael Simmons President		Intellivation
12.2	B	4:20 PM	Application of high-rate PECVD for improved mechanical stability of Roll-to-roll manufactured flexible organic electronics.	Michiel Top Research PhD Student		Fraunhofer FEP
12.3	B	4:40 PM	Development of a fully Integrated, Compatible, Materials Stack for Flexible Printed Electronics	Rahul Raut Director, Strategy & Technology Acquisition		Alpha Assembly Solutions
12.4	B	5:00 PM	Temporary bonding layers for plastic-based microfabrication of flexible displays	David Arreaga CEO		Ares Materials
12.5	B	5:20 PM	Process Design Kit for Flexible Hybrid Electronics	Tsung-Ching Jim Huang Sr. Research Scientist		Hewlett Packard Enterprise
THURSDAY, FEBRUARY 15, 2018
		7:00 AM	REGISTRATION OPENS & BREAKFAST - Sponsored by
13	A	8:00 AM - 9:45 AM	SESSION 13: EMERGING CAPABILITIES
13.1	A	8:00 AM	A Holistic Approach to Thermal Management in Flexible / Hybrid Electronics Using Carbon Fiber Technology	MP Divakar CEO and Michael Mo Co-Founder & CEO		Stack Design Automation and KULR Technology
13.2	A	8:25 AM	Game Changers: How multifunctional substrate and fibers enable NextFlex and AFFOA	Joey Mead Professor, Department of Plastics Engineering		University of Massachusetts, Lowell
13.3	A	8:45 AM	A Holistic Approach Towards Flexible Hybrid Integration for Large-Area Sensor Platforms by System Design and Demonstrations	James Sturm Professor		Princeton University
13.4	A	9:05 AM	Low Cost, Conformable OLCDs on Plastic - A Simple, Scalable Manufacturing Process for Organic TFT-based Displays	Paul Cain Strategy Director		FlexEnable
13.5	A	9:25 AM	Photonic Annealing of Perovskite Thin Films	Thad Druffle Theme Leader Solar Manufacturing R&D		University of Louisville
		9:45 AM	MORNING BREAK - Sponsored by
14	B	8:00 AM - 9:45 AM	SESSION 14: STANDARDS & RELIABILITY		SPONSORED BY:
14.1	B	8:00 AM	IPC - Printed Electronics Design Standards Update	Neil Bolding Technical Manager		MacDermid Performance Solutions
14.2	B	8:25 AM	Test Protocols Development for the Flexible Substrates in Wearable Applications	Pradeep Lall MacFarlane Endowed Professor & Director		Auburn University
14.3	B	8:45 AM	Stretch Testing of Flexible Electronics	Justin Chow Graduate Student		Georgia Institute of Technology
14.4	B	9:05 AM	Stretching Testing Method for Flexible Hybrid Electronics	Naotsugu Ando Chief		YUASA SYSTEM
14.5	B	9:25 AM	Moving towards High-Volume Manufacturing with Standards	Doug Suerich Product Evangelist		The PEER Group Inc.
		9:45 AM	MORNING BREAK - Sponsored by
15	C	8:00 AM - 9:45 AM	SESSION 15: FLEXIBLE ELECTRONICS MANUFACTURING
15.1	C	8:00 AM	Integration of Emerging and Evolving Technologies to Create Novel Products	John Heitzinger Director of Strategic Partnerships		Interlink Electronics
15.2	C	8:25 AM	Multek Industry 4.0 Strategy	Brendan Nagle R&D Engineer		Multek
15.3	C	8:45 AM	QRC Printed Hybrid Electronics	Kevin Rose Director of Business Development		Fourth Dimension Engineering
15.4	C	9:05 AM	Evaluation of 3D Molded Interconnected Device	Offir Duman Project Manager & System Engineer and Yitzchak (Isaac) Shpitzer Center of Excellence Lead for Flexible Technologies & Miniaturization		Flex Flex
15.5	C	9:25 AM	Evolution, Qualification and Latest Developments of Printed Hybrid Electronics	Mike Deppe Director of Engineering & Project Management		Molex
		9:45 AM	MORNING BREAK - Sponsored by
16	A	10:15 AM - 12:00 PM	SESSION 16: SENSORS & POWER
16.1	A	10:15 AM	System Design for Flexible All-Organic Reflectance Oximeter	Ana Claudia Arias Professor		University of California, Berkeley
16.2	A	10:40 AM	Carbon Nanotubes: Sensors and Other Uses	Robert Praino COO & Co-Founder		Chasm Technologies Inc.
16.3	A	11:00 AM	Ultra-Thin, solid-state rechargeable battery with vertically integrated solar cell	Brian Berland Chief Science Officer		ITN Energy Systems
16.4	A	11:20 AM	Ultra-light-weight, thin-film CdTe PV minimodules on flexible ceramic	Victor Plotnikov Principal Scientist		Lucintech Inc.
16.5	A	11:40 AM	Printed Carbon Nanotube Sensor for Gas Detection	Dominic Miranda Business Development Manager		Brewer Science
		12:00 PM	Presented by: LUNCH - Sponsored by & STUDENT POSTER AWARDS -
17	B	10:15 AM - 12:00 PM	SESSION 17: SUBSTRATES
17.1	B	10:15 AM	Flexible Glass Applications & Process Scaling	Sean Garner Senior Research Associate		Corning Incorporated
17.2	B	10:40 AM	Refinement of transparent conductive films on flexible glass by in-line flash lamp annealing	Manuela Junghaehnel Group Leader S2S Technologies & Coordinator Flexible Glass Activities		Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP
17.3	B	11:00 AM	Polyester Film Substrates for Flexible and Formable Electronics	Scott Gordon New Business Development Manager		DuPont Teijin Films
17.4	B	11:20 AM	Multi-Material Ribbon Ceramic Supply Chain to Product Application Roadmap for FHE	John Olenick President		ENrG Incorporated
17.5	B	11:40 AM	Polysulfide elastomers for use in flexible and stretchable electronics	Radu Reit CTO		Ares Materials
		12:00 PM	Presented by: LUNCH - Sponsored by & STUDENT POSTER AWARDS -
18	C	10:15 AM - 12:00 PM	SESSION 18: FHE CHIP INTEGRATION
18.1	C	10:15 AM	Investigation of Ultrathin/High IO Die Attach to Flexible Substrates	Michael Santos Advanced Technology Engineer		Jabil
18.2	C	10:40 AM	Flexible (1mm bending radius) Biocompatible Heterogeneous Fan-Out Wafer-Level Platform with the Lowest Reported Die-Shift (<6 µm) and Reliable Flexible Cu-based Interconnects	Amir Hanna Postdoctoral Scholar		University of California, Los Angeles
18.3	C	11:00 AM	Photonic Soldering to Enhance Manufacturability of Wearable Technology	Vahid Akhavan Senior Application Engineer		NovaCentrix
18.4	C	11:20 AM	Low Temperature flip chip bonding technology applicable to flexible hybrid electronics in the IoT era	Hiroshi Komatsu Director		CONNECTEC Japan Corporation
18.5	C	11:40 AM	Joining to Temperature Sensitive Substrates with Asymmetric Heating	Peter McClure Process Research Engineer		Universal Instruments Corporation
		12:00 PM	Presented by: LUNCH - Sponsored by & STUDENT POSTER AWARDS -
19	A	1:40 PM - 3:25 PM	SESSION 19: CONDUCTORS
19.1	A	1:40 PM	Novel Low Temperature Materials as Key Enablers of Flexible Hybrid Electronics	Bawa Singh Executive VP of Technology & Corporate Development		Alpha Assembly Solutions
19.2	A	2:05 PM	Versatile Molecular Silver Ink Platforms for Printed Electronics	Arnold Kell Senior Research Officer		National Research Council Canada
19.3	A	2:25 PM	Photonic sintering of micron particle conductive paste	Harvey Tsang Electronics Engineer		Army Research Labs
19.4	A	2:45 PM	Anisotropic Conductive Adhesives on Flexible Hybrid Electronics	Angel Rodriguez Undergraduate Student Researcher		Boise State University
19.5	A	3:05 PM	Design, Fabrication and Testing of High Resolution Aerospace Wear Sensor	Alan Shen Ph.D. Student		University of Connecticut
			ADJOURN
20	B	1:40 PM - 3:25 PM	SESSION 20: NEXT GEN ADVANCEMENTS
20.1	B	1:40 PM	Flexible Haptic Actuators – Like you never felt before	Sri Peruvemba Vice President of Marketing		Novasentis
20.2	B	2:00 PM	PDMS films for printed electronics - Methods and Advancements	Victoria Tran R&D Director		Delphon
20.3	B	2:25 PM	A "Flexible" solution for Internet of Things	Abhilash Iyer Research Engineer		Saape Designs
20.4	B	2:45 PM	Advancements in the manufacture of roll-to-roll smart and innovative devices by addressing production scalability and technology challenges	Nessima Kaabeche R&D Product Manager		Emerson & Renwick
20.5	B	3:05 PM	Water Vapor Transmission Rate (WVTR) Measurements for Ultra-High Barrier Materials used in the Display Industry	Georgia Gu Sr. Global Applications Specialist		MOCON
			ADJOURN
21	C	1:40 PM - 3:25 PM	SESSION 21: PROCESS CONTROL
21.1	C	1:40 PM	Process Stackup Software for Multilayer Printing	Kalsi Kwan Electrophysics Process Engineer		Boeing Research & Technology
21.2	C	2:05 PM	On-Line Defect Detection in Micro-Grids	Timothy Potts President		Dark Field Technologies, Inc.
21.3	C	2:25 PM	Non-Contact Stress Metrology for Flexible Electronics	Wojtek Walecki CTO		Frontier Semiconductor
21.4	C	2:45 PM	Direct digital manufacturing of human temperature monitoring device using flip chip method into silicone encapsulant	Sami Hawasli Electrical Engineer		Army Research Laboratory
21.5	C	3:05 PM	The Second Generation of Nanoscale Printing Processes and Equipment for Flexible Sensors and Electronics	Ahmed Busnaina William Lincoln Smith Professor		Northeastern University
			ADJOURN