downloadGroupGroupnoun_press release_995423_000000 copyGroupnoun_Feed_96767_000000Group 19noun_pictures_1817522_000000Member company iconResource item iconStore item iconGroup 19Group 19noun_Photo_2085192_000000 Copynoun_presentation_2096081_000000Group 19Group Copy 7noun_webinar_692730_000000Path
Skip to main content

2008年11月3日

晶圓廠投資與資本支出的變化
當前經濟衝擊產業發展

根據2008年10月World Fab Forecast分析報告顯示,受到全球經濟波動的影響,部分公司被迫將新廠投資計畫與目前的專案延宕至2009年年底或2010年,或甚至暫緩部分計畫,預估2009年晶圓廠設備支出將呈現下滑的走勢。

設備支出在2008年預期下滑27%,而目前預估2009年的設備支出將減少約11%。

晶圓廠的建置支出在2008年下滑41%,預估於2009年小幅提升5%。

由於消費的減少、新計畫的減少以及晶圓廠的關閉,導致記憶體晶圓廠的成長在2008年至2009年間只有6%。

預估整體晶圓廠產能於2008年底,每月可達1,560萬片,相較於2007年的17%的產能成長值,2008年僅有6%的成長。在2009年,整體產能預期可達到每月1,660萬片。更多報告,請參訪www.semi.org/fabs

A Changing Picture for Fab Investments and Capex
Current economic events impact the industry

An interim analysis of the World Fab Forecast database (Oct 2008) shows a decline in spending in 2009 for fabs equipping as some companies are forced to push out new and current project even further into late 2009 or into 2010, or put projects on hold.

Spending on fabs equipping in 2008 is expected to decline about -27%, while equipment spending for 2009 is currently forecasted to decline by -11%.

Fab construction spending will decline by -41% in 2008 and is estimate to increase by just +5% in 2009.

Spending cutbacks, project push outs, and fab closures are expected to result in Memory fab capacity growth of just 6% in both 2008 and 2009.

Overall fab capacity by year end in 2008 is expected to be about 15.6 million wafers (in 200 mm equivalents) per month, a growth rate of just 6% compared to 17% capacity growth in 2007. In 2009, total capacity is expected approach 16.6 million wafers per month.

For articles, charts and information visit us at www.semi.org/fabs.