Strategic Materials Conference - SMC 2014 Agenda

Agenda in PDF

Tuesday, September 30

Continental Breakfast / Registration 
8:30am-8:35amWelcome Remarks

Karen Savala
SEMI Americas


Tom TaylorOpening Remarks:

Thomas C. Taylor
Director, Corporate Business Development
Dow Chemical
Chair, SMC 2014 Committee
8:40am-9:20amMatt NowakOpening Keynote - Materials Innovation for the Digital 6th Sense Era

Matt Nowak (Biography)
Senior Director, Advanced Technology

9:20am-9:50amMark ThirskIndustry Dynamics in the Materials Supply Chain

Mark Thirsk (Biography)

Managing Partner
Linx Consulting
9:50am-10:20amNetworking Break
Session abstract - the opening session for SMC 2014 sets the stage for the conference through an examination of the macro-to-micro economic and materials trends faced by our industry.  The session features industry analyst experts who will highlight trends in wafer fab equipment spending, fundamentals of the foundry, memory, and logic sectors, semiconductor technologies that are driving changes in design and materials, and emerging technologies extending beyond the semiconductor sector.
10:20am-10:50am  Bill McCleanMajor Trends Shaping the Future of Integrated Circuit Industry

Bill McClean
IC Insights 
Duncan MeldrumThe Global Economic Outlook's Impact on Semiconductors

Duncan Meldrum
Chief Economist
Hilltop Economics LLC
11:20am-11:50amPatrick HoThe Changing Economics of the Semiconductor Capital Equipment Industry—A Wall Street Perspective

Patrick J. Ho
Senior Research Analyst 
Stifel Nicolaus
This session of the conference features presentations by IBM, INTEL, Triquint Semiconductor to discuss their concerns, strategies and visions for both current and new materials in the context of addressing device architectures and manufacturing technologies.  At the outset of the session, Lux Research will provide an overview entitled “Technology Trends for Emerging Devices”; the final talk from Stanford University will discuss 3D integration of logic and memory functions.  After the presentations, all session speakers will participate in an Executive Panel discussion, taking questions from the audience and from each other.  The reception that follows provides an opportunity for continued dialogue and Q&A with the panelists and fellow conference attendees.
1:00pm-1:30pmRoss KozarskyEmergingTechnology Trends and Drivers for Next Generation Electronic Device Demand

Ross Kozarsky (Biography)
Senior Analyst
Lux Research
Geraud DuboisPast and Current Strategies Addressing Porous Low-K Materials Plasma Damage

Dr. Geraud Dubois
Manager, Hybrid Polymeric Materials 
IBM Research
Todd YounkinContinued CMOS Scaling through Exploratory Materials Research

Dr. Todd Younkin (Biography)
Sr. Staff Research Engineer, Components Research, Advanced Materials 
Intel Corporation
Angela FranklinThe Unique Process Material Supply Chain Challenges for Mid-sized or III-IV Semiconductor Companies

Angela Franklin
Senior Corporate Supplier Engineer
TriQuint Semiconductor
Networking Break 
H.-S. Philip WongMonolithic 3D Integration of Logic and Memory: the N3XT Frontier 

Dr. Philip Wong (Biography)
Department of Electrical Engineering and Center for Integrated Systems
Stanford University


IDM Executive Panel: IBM Research, Intel, TriQuint Semiconductor, Stanford University, Lux Research
Moderator:  Kurt Carlsen, Air Liquide

5:30pm-7:30pmSMC Hospitality Reception

Wednesday, October 1
8:30am-8:35amIntroductory Remarks:

Thomas C. Taylor
Director, Corporate Business Development
Dow Chemical
Chair, SMC 2014 Committee
Session abstract:  The sophistication and reliability of the global supply chains that evolved to support technology industries over the past 50 years is a testament to human ingenuity and perseverance, as well as the power of competitive markets.  In the electronics industry particularly, the coordination among players needed to get the right products to the right markets at the right time and the right price, with uncompromised quality, is staggeringly complex.  

Over time, the IC industry has developed a range of best practices that has, when structured to support the interests and capabilities of the key actors in the supply chain and enforced with consistency, created an interlocking range of dependencies.  Ideally, each participant understands their obligations in keeping the growth engine running.  Equally, each participant understands, and learns to depend on, what their customers andindustry peers will deliver.  And each aspiring entrant knows what they need to do to be adopted as a trusted participant in the ecosystem.

Looking forward to the challenges of the next decade, the nature of some of these relationships may change:  some grand challenges of the past become the everyday subjects for continuous improvement, while other ‘brick walls’ emerge that are overcome with coordinated partnerships, alliances and collaborative research.  Using the right tool – the right vendor/customer engagement models – is a discipline that will increasingly separate the innovation leaders from the laggards.

The keynote will highlight some of the major ‘lessons learned’ in customer/vendor interdependence from the Intel perspective, discuss how different engagement models come into play at different stages of the product innovation and commercialization process, and provide some thoughts on where, why and how new models may emerge.

8:35am--9:15amTim HendryKeynote: Strategies and New Models for Creating an Affordable Material Supply Chain

Tim G. Hendry (Biography)
Vice President, Technology Manufacturing Group
Intel Corporation
9:15am-9:45amDennis HausmannChallenges Facing Silicon Dielectric Atomic Layer Deposition for HVM

Dr. Dennis M. Hausmann (Biography)
Technical Director - ALD Dielectrics 
Lam Research
9:45am-10:15amJames O'NeillAccelerating Yield in a Disruptive Environment

Dr. James O'Neill (Biography)
Chief Technology Officer

10:15am-10:30amAdrienne PierceStrengthening our Supply Chain: SCIS Working Group

Adrienne Pierce (Biography)
Director of Product Management
Edwards Vacuum

10:30am-10:45amNetworking Break 
Track 1: Advanced Memories/Embedded Memories (MRAM, CBRAM, PRAM, etc.) Track 2: Advanced Packaging, TSVs, and "Beyond 10nm"
Significant challenges to the traditional memory device roadmaps are beginning to emerge which may limit further scalability in the near future.  NAND flash is moving towards 3-D to decouple from the high cost of lithography, and DRAM is hurdling towards what many experts believe is a brickwall due to technical and cost challenges.  Many alternative types of memory have been under development in recent years that may soon be called upon for large scale implementation.  The Advance Memory Parallel Track will explore the various types of devices under development, their strengths and weaknesses, as well as the opportunities and challenges they will present for materials suppliers in the near future. Over the past decade, back-end-of-line (BEOL) and device packaging technologies have shared credit with FEOL device scaling for keeping the microelectronics industry on its historic track of offering ever-increasing data storage and computation power in ever-diminishing real estate, and at ever-decreasing cost-per-function.  Each new package architecture, from FC/BGA to planar and stacked System-in-Package, TSV/3D, and ultra-low-cost ‘packageless’ chip-on-board assembly, comes with a host of performance and reliability hurdles that are met with a combination of meticulous design decisions, precision manufacturing processes, and specialized materials.  This Track session features speakers whose companies are at the forefront of innovation in new IC packaging, who stay abreast of current trends, and who are often among the bellwethers for adoption for new materials and processes.  The overall session theme is to highlight current BEOL/packaging materials challenges, describe ways in which several of these challenges are being met, and anticipate the demands that will emerge in the next waves of semiconductor device and integration innovation.
10:50am-11:20amNorma SosaMaterial Needs for Advanced Computer Memory

Dr. Norma Sosa (
IBM T.J. Watson Research Center
Jan Vardaman IC Packaging Materials:  Hot Spots for Growth

E. Jan Vardaman

President and Founder (Biography)
TechSearch International, Inc. 
11:20am-11:50amMark RaynorAdvanced Memory Technologies:  New Materials, New Challenges

Dr. Mark Raynor (Biography)
Senior R&D Director

Rama AlapatiMaterials Challenges in Advanced Packaging

Ramakanth Alapati (Biography)
Director, Package Architecture

11:50am-12:20pmSuresh Upadhyayula
Materials Challenges in Advanced Flash Memory Packaging

Suresh Upadhyayula
Senior Director, Packaging Engineering           
Ou LiThin Packaging Technologies

Ou Li (Biography)

Director, Engineering
ASE, Inc.

Session Abstract: 
1:30pm-2:00pmDavid BemHorses for Courses : Fitting the Product Development Model to the Mission

Dr. David Bem (
Vice President, Advanced Materials Division
Dow Chemical   
2:00pm-2:30pmWayne MitchellSimplifying Complexity: A New Paradigm for Supplying Materials to the Semiconductor Industry

Wayne Mitchell (Biography)
Vice President and General Manager, Electronics
Air Products & Chemicals
2:30pm-3:00pmJean-Marc GirardReducing Risks of New Materials Development and Deployment through Collaboration and Transparency between Industry Stakeholders

Dr. Jean-Marc Girard (Biography)
Chief Technology Officer
Air Liquide Electronics 
3:00pm-3:15pmNetworking Break
3:15pm-3:45pmKevin O'SheaManaging Supply Chain Risks: A Supplier's View

Kevin O'Shea (Biography)
Director of Marketing
SAFC Hitech
3:45pm-4:45pmExecutive Panel
 Risto PuhakkaModerator 
Risto Puhakka (Biography)
VLSI Research


  • Air Products
  • Air Liquide Electronics
  • Dow Chemical
  • Entegris
  • Intel Corporation
  • SAFC Hitech
Description: How the Leaders Do It All (and what they do when they can’t)

The path to commercialization of new-to-the-world materials into the IC industry is a tortuous trail.  Hazy at first, new product concepts arise from needs where chemistry provides a route to an effective and economically viable solution.  That is, if only we can:

  • invent the right molecules,
  • synthesize and formulate with a precision that pushes the limits on the most sensitive metrology systems ever devised, and
  • deliver the resulting products with ‘six sigma’ levels of performance and quality at
  • a price that creates value for both the customer and, ultimately, the materials’ company shareholders. 

The range of skills and disciplines that must be assembled and integrated to successfully play in this arena is as broad and deep as for the customers they support.  No less sophisticated is the decision process in deciding where and how to deploy these resources, and how to concentrate or diversify the range of new-product-development initiatives that the company can fund and staff.  Even the largest, most successful companies in specialty materials have finite resources to deploy, and opportunity costs to consider. 

How do the bellwether companies in our industry prioritize their research, work with ‘champion’ customers, and partner with key suppliers today?  How will that change especially when the costs-to-play (and the consequences of failure) escalate with each new technology node brought to high volume manufacturing?

4:45-5:00pm Closing Remarks
Thomas Taylor, Dow Chemical 
Gene Karwacki, Air Products & Chemicals 

Agenda as of September 25, 2014. Subject to change.

Go back to