SEMI 台灣封裝測試委員會委員台灣積體電路股份有限公司 研究開發組織副總經理 余振華 博士 www.tsmc.com Education: M.S. & B.S., Physics and Materials Science and Engineering , NTU Ph.D. in Materials Science & Engineering from Georgia Institute of Technology, Atlanta, USA Experience: Senior Director, Integrated Interconnect and Package Technology Division, TSMCGeneral co-chairs of IEEE IITCMember of the advisory board of IMPACTMember of Industrial Advisory Board of Microsystems Industrial Group at Microsystems Technology Laboratories/MIT
