Interview: Frank P. Averdung, SUSS MicroTec

Introduction
SUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets with more than sixty years of history. The product portfolio covers high-precision equipment for wafer and photomask processing. In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing.

With its global applications and service infrastructure SUSS MicroTec supports more than 8,000 installed systems worldwide. SUSS MicroTec has app. 600 employees worldwide and is headquartered in Garching near Munich, Germany.

Revenue in 2009: 103,9 Mio euro 

Questions

What business sees SUSS MicroTec in Taiwan?

SUSS MicroTec has a strong focus on being close to local markets and its customers. We are convinced that reducing the distance to our customers as much as possible is part of the success of our company. A powerful service organization with expertise and practical knowledge supports our key markets Taiwan, Japan, China, Singapore, and Korea. Especially in Taiwan we currently see a high level of business activities. Recently we have added to our Taiwanese headquarters in Hsin-Chu and the office in Kaohsiung a third office in Tainan. With the increased manpower we can meet the growing demand and successfully maintain the large installed base.

What markets is SUSS MicroTec generally in?

SUSS MicroTec high-precision lithography equipment like Mask Aligners and Coaters/Developesr as well as high throughput production tools like the Wafer Bonders find their home for example in the manufacturing of MEMS, devices that are used in automotive, medical and industrial applications. The growing use of solid state lighting elements in backlighting for televisions, car headlights and room lighting drives a very strong demand for high-brightness LED manufacturing equipment. We have responded to this with a high throughput mask aligner dedicated for LED production enabling our customers to cut down cost per lumen and increase their production efficiency.

Traditionally SUSS MicroTec is the leading equipment specialist for Advanced Packaging. With our mask aligners, coaters and developers we offer state of the art equipment and process solutions for wafer-level packaging. In Taiwan we enjoy a market share of more than 90% with our mask aligners in this market segment. As experts in the field of packaging we are also deeply involved in developing with customers and research institutes structuring and bonding solutions for the 3D integration technology.

In the field of 3D integration SUSS MicroTec is quite visible. What can the industry expect from MicroTec?

SUSS MicroTec has played a vital role in developing equipment and process solutions for Advanced Packaging. Based on this experience SUSS MicroTec takes the opportunity of 3D integration very serious. In the area of Temporary Bonding and De-bonding we have partnered with various materials suppliers like 3M, DuPont and Thin Materials to develop suitable processes with different properties. We are the only equipment supplier who is able to offer multiple solutions for these processes. With that we provide an unprecedented level of flexibility to our customers protecting their investment into the bonding equipment. In addition we are cooperating with several research institutes worldwide to advance the 3D integration technologies. In Taiwan SUSS MicroTec has joined the multi-national Ad-STAC consortium led by ITRI. In their 300mm development line we are working in close cooperation with ITRI and its partners on 3D R&D. With these activities SUSS MicroTec is well prepared for the future of 3D volume production.

Why did SUSS MicroTec decide to merge three of their production sites?

We see that the complexity of equipment development and manufacturing will considerably increase in the future. SUSS MicroTec has decided to address this challenge by merging three production sites into one. The activities for coaters/developesr in Vaihingen (Germany), for photomask equipment in Sternenfels (Germany) and for wafer bonders in Waterbury (USA) will be combined into one single development and production site in Sternenfels. Through the acquisition of HamaTech we have an ultra-modern production building with sufficient cleanroom space for the anticipated growth at our disposal. The appointment of the new VP R&D and CTO Dr. Knippelmeyer goes hand in hand with the decision to more tightly integrate the product development of our three divisions. Our customers will benefit from the synergies we’ll generate in the technology, product and platform development.

Does SUSS MicroTec have any news at this year’s Semicon Taiwan?

Of course we will take the opportunity to present new solutions to our Taiwanese visitors. We expect strong interest for the MA100e Gen2, our high throughput mask aligner solution dedicated to LED applications. A new illumination system for our mask aligner technology is presented at the MEMS Forum on September 9^th. We will also introduce the CB200M, our permanent bonding solution for MEMS, LED and 3D Integration applications, and will show interested visitors the options for temporary bonding with our production bonder XBC300.

This year it will be the first time that the new SUSS Photomask Equipment division, the former HamaTech, is represented at the SUSS MicroTec booth in Taiwan. Here we will introduce our mask integrity solutions and especially the Mask Track Pro ® B/D, a new extension of the next-generation lithography Mask Track Pro ® platform for baking and developing.

Come and visit us; we are looking forward to meeting you there!

2010/09