MILPITAS, Calif. ─ April 8, 2024 ─ SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the United States Department of Commerce’s announcement of a Preliminary Memorandum of Terms for an award under the CHIPS and Science Act to support the construction of Taiwan Semiconductor Manufacturing Company (TSMC) chip manufacturing facilities in Arizona. The award includes $6.6 billion grants, as much as $5 billion in loans and an investment tax credit.
美國商務部宣布簽署初步備忘錄，基於《晶片與科學法》（CHIPS and Science Act）補助台積電（TSMC）在亞利桑那州設立晶圓廠。對此，專為全球電子設計暨製造供應鏈服務的SEMI國際半導體產業協會表示讚許。除了66億美元的直接補助外，初步備忘錄亦提供最高達50億美元的貸款和投資稅收抵免。
“We applaud the U.S. Department of Commerce for taking this significant step to enhance the resilience of the domestic semiconductor supply chain,” said Joe Stockunas, President of SEMI Americas. “This CHIPS and Science Act award is a key stride towards a 2-nanometer process, positioning the United States to produce the most advanced semiconductor chips at scale in order to advance global supply chain stability and help meet worldwide chip demand across various markets.”
“This grant increases TSMC's total investment in Arizona to $65 billion and is expected to create over 25,000 direct construction and manufacturing jobs, further demonstrating the positive economic impact and job creation potential of such advancements in semiconductor manufacturing,” Stockunas said. “Government investments like the CHIPS and Science Act grant for TSMC play a crucial role in semiconductor manufacturing and are of immense importance to economies globally.”
SEMI全球行銷長暨台灣區總裁曹世綸表示：「美國商務部基於《晶片與科學法》強化美國半導體供應鏈韌性，有助促進全球供應鏈的穩定，並助力滿足全球各個市場強勁的晶片需求。此項補助將使台積電在亞利桑那州的總投資增加至650億美元，預期將直接創造超過25,000個營建和製造相關就業機會，進一步證明半導體製造業的進步不僅有利於經濟，還有創造工作機會的潛力。此一台積電投資補助案對於全球半導體製造的發展至關重要，對全球經濟發展也具重大影響性。」
The recently announced SEMI 300mm Fab Outlook to 2027 report projects the Americas region will double 300mm fab equipment investments from US$12 billion in 2024 to US$24.7 billion in 2027, significantly narrowing the gap with the top three spending regions, which are projected to invest between US$26.3 billion and US$30 billion in chipmaking equipment in 2027.
Visit SEMI Global Advocacy to learn more about public policy efforts and developments, and SEMI Workforce Development for more information on efforts to address the microelectronics industry’s talent needs.
SEMI最近發布的《12吋晶圓廠2027年展望報告》 (300mm Fab Outlook Report to 2027) 預測，美國12吋晶圓廠設備投資可望翻倍，從2024年的120億美元增加到2027年的247億美元，將大幅縮小與前三大支出區域的差距。排名前三的區域2027年的晶片製造設備支出預期將介於263億美元至300億美元之間。
更多關於公共政策活動與發展的資訊，歡迎造訪SEMI全球倡議服務專頁：https://www.semi.org/en/global-advocacy；更多關於微電子產業人才培育工作的資訊，請造訪SEMI勞動力發展