European SiPAT Member List
Ayad Ghannam
Founder & CEO
3DiS Technologies
Hervé Delabre
Project Development Manager
AEMtec GmbH
Ari Kuukkala
Sales Director
Afore Oy
Frederic Mauron
International Sales Engineer
Aptasic SA
Bernd Roelfs
Global Product Manager, Semiconductor Advanced Packaging
Atotech
Hugo Pristauz
Vice President Technical Development Advanced Technology DA
BESI Austria GmbH
Marco Koelink
Business Development Manager
Chip Integration Technology Center
Steffen Kroehnert
President & Founder
ESPAT-Consulting
Lutz Mattheier
Manager Technology & Process Development
First Sensor Microelectronic Packaging GmbH
Sven Rzepka
Head of Micro Materials Center
Fraunhofer ENAS
Tanja Braun
Fan-out Wafer & Panel Level Packaging Program
Fraunhofer IZM
Thomas Fries
CEO
FRT GmbH
Markus Keil
CEO
HSEB Dresden GmbH
Danny Lambrichts
Group Leader Asic Production
Imec
Xavier Buch
Vice President Sales and R&D Semiconductor
JSR Micro
Moreno Lupi
Technical Director
Microtest
Thomas Oppert
Vice President Global Sales & Marketing
Pac Tech
Cedric Mayor
CTO
Presto Engineering
Dieter Schreiber
Sales & Marketing Director
RoodMicrotec
Ignas van Dommelen
Manager Sales & Marketing
Sencio BV
Gerd Jungmann
Business Development SiP
Swissbit Germany AG
Gilles Fresquet
CEO
Unity SC
If you are interested in joining SEMI Special Interest Group focused on the common issues of packaging, assembly and testing, please contact Tom Salmon at tsalmon@semi.org.