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January 17, 2023 - January 19, 2023

EofE Vertical Sponsor Logos

Join us for three-days of technology assessments, updates, discovery and planning workshops focused on the development of the electronics ecosystem and flexible, hybrid electronics, medical monitoring sensors, and their application to driving development in new electronics packaging approaches.

Industry experts and leaders will come together to focus on identifying gaps in technology development, including in design, manufacturing, standards and environmental sustainability. 

Time

8:00 am - 5:00 pm

Location

SEMI & NEXTFLEX
Milpitas & San Jose, CA
United States

EofE Vertical Sponsor Logos

SEMI FlexTech FHE Technical Gap Analysis Workshop  - Tues. 1/17 - 8 am-12 noon
@ SEMI - 673 S. Milpitas Blvd - Milpitas, CA

During this workshop the attendees will complete a Technical Gap Analysis in preparation for FlexTech’s next Request for Proposals (RFP), including exploring topics and technology development required to meet development objectives. Lunch will be served following the workshop.

SEMI NBMC Technical Gap Analysis Workshop - Tues. 1/17 - 1:00-5:00 pm
@ SEMI - 673 S. Milpitas Blvd - Milpitas, CA

Attendees will turn their sights to preparing the technical topics / gaps in the Nano-Bio Materials space to explore topics and technology development required to meet development objectives.  A networking reception will follow the workshop.

SEMI FlexTech - FHE Standards Workshop - Wed 1/18 - 8:00am - 1:00pm
@ SEMI - 673 S. Milpitas Blvd - Milpitas, CA

Many topics and paths were identified at the previous, very successful workshop in July 2022.  This workshop will take the work a step further and create scopes of work for this very important foundation required to propel the design in of FHE-based components.  This workshop includes a continental breakfast and lunch.

NextFlex - Hybrid Electronics for Advanced Packaging Workshop - Wed 1/18 2:00 - 7:00 pm & Thurs 1/19 - 8:00 am - 5:00 pm
@NextFlex, 2244 Blach Place, Suite 150, San Jose, CA

As the community awaits the release of request for proposals (RFPs) for programs within the CHIPS and Science Act, NextFlex is hosting a workshop to align the ecosystem’s vision on how additive hybrid electronics manufacturing can shape the future of domestic advanced semiconductor packaging. Join us for presentations from visionary speakers on how their organizations plan to participate in the CHIPS and Science Act programs and participate in breakout sessions focused on information sharing, proposal concept refinement, and formation of proposal teams.

Breakout topics include:

  • Direct Write Interconnects
  • Substrates and Buildup Layers
  • Interposers, Bridges & Architectures
  • Circuitization

Agenda

Tuesday, January 17 @ SEMI Milpitas

8:00 am - 8:30 am

Continental Breakfast

SEMI FlexTech FHE Technical Gap Analysis Workshop

8:30 am - 8:45 am
Melissa Grupen-Shemansky, SEMI
Melissa Grupen-Shemansky
CTO & VP, Technology Communities
SEMI

Introduction

8:45 am - 9:00 am
Eric Forsythe, PhD
Program Manager
ARL

RFP Process and Background

9:00 am - 9:15 am
Bob Pranio, CHASM
Robert Praino
Chief Innovation Officer & Co-Founder
CHASM Advanced Materials

A Look Back and The Path Ahead & RFP Process

9:15 am - 10:45 am

Breakout Sessions for Technical Gap Analysis

10:45 am - 11:00 am

Break

11:00 am - 11:45 am

Break out Review & Summary

11:45 am

Wrap-Up

12:00 pm - 1:00 pm

Lunch

CHASM Technologies Logo

NBMC Technical Gap Analysis Workshop

1:00 pm - 1:15 pm
Melissa Grupen-Shemansky, SEMI
Melissa Grupen-Shemansky
CTO & VP, Technology Communities
SEMI

Introduction

1:15 pm - 1:30 pm
Gina Tollefson
Program Manager
AFRL

NBMC 2023

1:30 pm - 1:45 pm
Azar Alizadeh
Principal Scientist
GE Research

RFP Process & Insights

1:45 pm - 2:00 pm

Break

2:00 pm - 4:00 pm

NBMC Break Out Sessions

4:00 pm - 4:45 pm

Final Review & Summary

4:45 pm - 5:00 pm

Wrap-Up

5:00 pm - 7:00 pm

Reception & Networking

CMU Logo

Wednesday, January 18, 2022

FHE Standards Workshop

8:00 am - 8:30 am

Continental Breakfast

8:30 am - 8:45 am
Gity Samadi
Gity Samadi
Sr. Director of R&D Programs
SEMI
PT
Paul Trio
Director, SEMI Standards
SEMI

Introduction of Project & Status

8:45 am - 9:15 am
Randall Parker
Randall Parker
American Semiconductor

The Need for Standards in Flexible & Printed Electronics

Bayflex logo
9:15 am - 10:45 am

Breakout Session on Selected Topics

10:45 am - 11:00 am

Break

11:00 am - 11:45 am

Review and Summaries from Breakouts

11:45 am - 12:00 pm

Wrap-Up

12:00 pm - 1:00 pm

Lunch

UW SoEngineering logo
1:00 pm - 2:00 pm

Travel Time to NextFlex -

For a detailed program agenda for this workshop visit NextFlex.us

Registration

Sponsor tile for Jan workshops

Registration covers all 3 days of Workshops.  No discounts given for partial attendance.  Full refunds through December 17, 2022.  December 18-January 19 - substitutions only.

SEMI, FlexTech, NBMC & NextFlex Members:  $199

Non-Members:  $499

If you have any questions, please contact Gity Samadi, gsamadi@semi.org.

Sponsor tile for Jan workshops

Hotel Information

SEMI has secured a Group Rate at the Staybridge Suites at 321 Cypress Drive, Milpitas, CA, at the special rate of $202/night with breakfast included.  

To reserve the rate visit Staybridge Suite website and follow these steps:

Step 1 – Enter your dates

Step 2 – Choose Rate Preference, then group rate, type in SJ1

Alternatively, you may email the General Manager at luz@sbsmilpitas.com

HEALTH AND SAFETY

Your health and safety are our top priority.  We monitor developing federal, state, and local health and safety recommendations and requirements to determine the most appropriate safety protocols for our in-person events.  For international attendees arriving from outside of the United States, please review the government travel guidance to confirm eligibility and requirements for travel.

FACE COVERINGS 

  • Although masks are not required, attendees are encouraged to determine use based on their own personal comfort level as well as to be respectful of other's individual choice.