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October 12, 2022

HI Webinar 2022

As we approach the inflection point of explosive expansion of innovations and electronic products into our global society, and the plateauing of CMOS’s scaling advantage, continued progress now requires a different phase of innovation.  The Heterogeneous Integration Roadmap (HIR) provides a long-term vision for the electronics industry to move beyond CMOS scaling, identifying difficult future challenges and potential solutions.  Heterogeneous Integration is and will be the key technology direction going forward. This webinar will provide a heterogeneous integration overview and how material suppliers are responding to this dynamic technology environment.


10:00 am - 11:00 am


Online - Zoom,
United States

HI Webinar 2022


10:00 am - 10:10 am
Kim Yess
Kim Yess
Executive Director, WLP Materials
Brewer Science, Inc.

Welcome & Introduction

10:10 am - 10:30 am
E. Jan Vardaman, TechSearch International
Jan Vardaman
TechSearch International, Inc.

Markets & Challenges Around Heterogenous Integration

10:30 am - 10:50 am
Diane Sheele
Diane Sheele
Head of Marketing Surface Prep and Clean, Patterning Business Field
EMD Electronics

EMD Approach to the Rise of Heterogeneous Integration

10:50 am - 11:00 am