downloadGroupGroupnoun_press release_995423_000000 copyGroupnoun_Feed_96767_000000Group 19noun_pictures_1817522_000000Member company iconResource item iconStore item iconGroup 19Group 19noun_Photo_2085192_000000 Copynoun_presentation_2096081_000000Group 19Group Copy 7noun_webinar_692730_000000Path
Skip to main content

October 12, 2022

HI Webinar 2022

As we approach the inflection point of explosive expansion of innovations and electronic products into our global society, and the plateauing of CMOS’s scaling advantage, continued progress now requires a different phase of innovation.  The Heterogeneous Integration Roadmap (HIR) provides a long-term vision for the electronics industry to move beyond CMOS scaling, identifying difficult future challenges and potential solutions.  Heterogeneous Integration is and will be the key technology direction going forward. This webinar will provide a heterogeneous integration overview and how material suppliers are responding to this dynamic technology environment.

Time

10:00 am - 11:00 am

Location

Online - Zoom,
United States

HI Webinar 2022

Agenda

10:00 am - 10:10 am
Kim Yess
Kim Yess
Executive Director, WLP Materials
Brewer Science, Inc.

Welcome & Introduction

10:10 am - 10:30 am
E. Jan Vardaman, TechSearch International
Jan Vardaman
CEO
TechSearch International, Inc.

Markets & Challenges Around Heterogenous Integration

10:30 am - 10:50 am
Diane Sheele
Diane Sheele
Head of Marketing Surface Prep and Clean, Patterning Business Field
EMD Electronics

EMD Approach to the Rise of Heterogeneous Integration

10:50 am - 11:00 am

Q&A