May 16, 2024
SEMI Spring Breakfast Forum
Organized by the SEMI Texas Chapter
Time
8:00 am - 12:00 pm
Location
Texas State University, Round Rock Campus
Avery Building, Room 252, Teaching Theatre
1555 University Blvd.
Round Rock, TX 78665-8017
United States
Advancements in Advanced Packaging: Unveiling the Future of Electronics Integration
Delve into the cutting-edge technologies revolutionizing the world of electronics integration. As electronic devices continue to evolve, the demand for smaller, faster, and more efficient packages becomes imperative. This breakfast forum organized by the SEMI Texas Chapter will explore the latest trends, breakthroughs, and innovations in advanced packaging that are reshaping the landscape of electronics manufacturing in Texas and other key areas of the US.
Some key topics to be covered are 3D IC Integration, Fan-Out Wafer-Level Packaging (FOWLP), System-in-Package (SiP) Design, Heterogeneous Integration, Advanced Materials for Packaging and Emerging Technologies.
Agenda
Thursday, May 16, 2024 | Central Time
Registration and Networking Breakfast
Welcome
Welcome and Introductions
TBA
Networking Break
TBA
TBA
Panel Discussion
Closing Remarks & Ken Parmerter Memorial Scholarship Ceremony
Adjourn
Registration
PRICING
Early Bird (Before May 2nd, 2024):
Member: $75 | Non-member: $100
Regular Pricing (starting May 2nd, 2024):
Member: $100 | Non-member: $125
Cancellation Policy
Registration is final. No refunds provided. No substitutions.
Sponsors
Become a Sponsor
Sponsorships can be tailored to meet your branding and marketing objectives. Become a sponsor and brand your company at the Texas Chapter Spring Breakfast Forum.
Contact Michelle Fabiano, mfabiano@semi.org to learn about available sponsorship opportunities.
Program Questions
Contact Michelle Fabiano, mfabiano@semi.org