We are proud to announce that MRSI, Mycronic Group will be exhibiting at the 24th China International Optoelectronic Exposition (CIOE) and will present at the CIOE Conference.
This event will be held from September 7-9th at the Shenzhen World Exhibition and Convention center. We will be showcasing our family of die bonders and our latest product releases targeting our fast-growing markets of aerospace & defense, medical, datacom and emerging technologies including high performance laser diodes and LiDAR. Using case studies across our many markets we will be discussing how our decades of successfully installed systems and innovation continue to satisfy our customers’ requirements regarding reliability, high speed, flexibility and high precision.
MRSI will be providing live product demos of the recently launched MRSI-H-HPLD+ along with various assembly technologies and solutions with detailed insights. The MRSI-H-HPLD+ is the latest advancement in the MRSI-H/HVM series product line. This new variant of the successful MRSI-H-HPLD, tailored for high power laser die attachment applications, significantly improves the throughput by using parallel processing while maintaining high accuracy and flexibility.
Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems, Mycronic Group and General Manager of MRSI Automation (Shenzhen) Co., Ltd will present “Discussion on photonics chip assembly technology, equipment and development trends” during the Optoelectronic Chip Design, Manufacturing and Packaging Technology Forum on September 8, 2022.
The timing of this presentation is at a crucial time in high-tech manufacturing. The growth of photonics chips for traditional and emerging applications continues at a fast pace driven by the well-recognized need for larger bandwidth. The assembly technology and equipment for photonics chips are different from those for traditional semiconductor IC packaging. In this speech, Dr. Zhou will discuss the special requirements, technical challenges and new trends in photonics chip packaging. He will also show MRSI’s key technologies and related experimental results of photonics chips assembly.
For additional information, please contact:
Dr. Limin Zhou
Senior Director, Strategic Marketing, MRSI Systems, Mycronic Group and General Manager of MRSI Automation (Shenzhen) Co., Ltd.
Tel: +86 135 0289 9401
E-mail: limin.zhou@mycronic.com
About MRSI Systems
MRSI Systems (Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com
About Mycronic
Mycronic is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic’s headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, the Netherlands, Singapore, South Korea, United Kingdom, the United States and Vietnam. Mycronic is listed on Nasdaq Stockholm. www.mycronic.com