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This 10th edition of the Global Semiconductor Packaging Materials Outlook (GSPMO) is authored by TECHCET and TechSearch International, Inc., in cooperation with SEMI.

The report provides coverage on the packaging materials markets including substrates, leadframes, bonding wire, encapsulation materials, underfill materials, die attach, solder balls, wafer level package dielectrics, and wafer-level plating chemicals. Solder Balls was not included in this report edition due to lack of interest.

In total, the semiconductor packaging materials market covered in this study was US$26.1 billion in 2022 globally, and it is forecasted to be about US$29.8 billion in 2027, a 2.6% CAGR.

 

Publication Date:

Principal Analysts:

Dr. Dan Tracy of Techcet and E. Jan Vardaman of TechSearch International, Inc.

Format:

Adobe® PDF (.pdf), Microsoft® Excel® file (.xls)
GSPMO 2023 landing page graphic

Global Semiconductor Packaging Materials Outlook (2023 Edition) is a comprehensive market research study that examines semiconductor packaging technology trends and their impact on the packaging materials markets. The report quantifies the packaging materials markets by segment and region, highlights new opportunities for emerging package form factors, defines supplier market share, and presents market forecasts through 2027.


Global Semiconductor Packaging Materials Outlook is an essential business tool for anyone interested in the plastic packaging materials arena. Packaging materials directly affect semiconductors' performance, reliability and cost, and advancements in packaging materials technology offer the potential for significant improvement across all these areas.

 

**Multi-user and Enterprise licenses must be purchased when more than 1 user accesses SEMI reports/databases**

 

Product Information

Features

  • Technology trends
  • Regional market size
  • Five-year market forecast to 2027
  • Market size in revenue and units
  • Excel workbook file summarizing market information 
  • Supplier market share
  • Capacity and utilization trends 

Benefits

  • Gain insights to worldwide packaging material technology trends, market size, and market forecast
  • Learn about market drivers and advancements in packaging materials.
    Use benchmark data to validate business opportunities and assumptions

 

Table of Contents

EXECUTIVE SUMMARY 

1 INTRODUCTION 
   Methodology 
   Assumptions 
   Report Organization 

2 SEMICONDUCTOR PACKAGING  
   Industry Market Trends  
   Regional and Market Issues 
   Materials Needs – Customer Input
   End-market Applications 

3 SUBSTRATES 
   Laminate Substrates 
   Build-up Substrates 
   Organic Substrates
   Markets and Forecasts Supply

4 LEADFRAMES 
   Technology Trends 
   Markets and Forecasts  
   Supply

5 BONDING WIRE 
   Technology Trends 
   Markets and Forecasts  
   Supply

6 Encapsulation Materials
   Technology Trends 
   Markets and Forecasts  
   Supply

7 UNDERFILL MATERIALS 
   Technology Trends 
   Markets and Forecasts  
   Supply

8 DIE ATTACH MATERIALS 
  Technology Trends 
   Markets and Forecasts  
   Supply

9 WAFER LEVEL PACKAGE DIELECTRICS
   Technology Trends 
   Markets and Forecasts  
   Supply

10 WAFER LEVEL PLATING CHEMICALS
   Requirements

   Markets and Forecasts  
   Supply

11 SUMMARY AND CONCLUSIONS

APPENDICES

In-person interview with material suppliers, packaging subcontractors and semiconductor manufacturers around the world are the sources of information for this study. Market size information is developed through primary research and modeling. Five-year market forecasts are developed based on different scenarios of new technology penetration and market growth. 

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