This 10th edition of the Global Semiconductor Packaging Materials Outlook (GSPMO) is authored by TECHCET and TechSearch International, Inc., in cooperation with SEMI.
The report provides coverage on the packaging materials markets including substrates, leadframes, bonding wire, encapsulation materials, underfill materials, die attach, solder balls, wafer level package dielectrics, and wafer-level plating chemicals. Solder Balls was not included in this report edition due to lack of interest.
In total, the semiconductor packaging materials market covered in this study was US$26.1 billion in 2022 globally, and it is forecasted to be about US$29.8 billion in 2027, a 2.6% CAGR.
Publication Date:
Principal Analysts:
Dr. Dan Tracy of Techcet and E. Jan Vardaman of TechSearch International, Inc.Format:
Adobe® PDF (.pdf), Microsoft® Excel® file (.xls)
Global Semiconductor Packaging Materials Outlook (2023 Edition) is a comprehensive market research study that examines semiconductor packaging technology trends and their impact on the packaging materials markets. The report quantifies the packaging materials markets by segment and region, highlights new opportunities for emerging package form factors, defines supplier market share, and presents market forecasts through 2027.
Global Semiconductor Packaging Materials Outlook is an essential business tool for anyone interested in the plastic packaging materials arena. Packaging materials directly affect semiconductors' performance, reliability and cost, and advancements in packaging materials technology offer the potential for significant improvement across all these areas.
**Multi-user and Enterprise licenses must be purchased when more than 1 user accesses SEMI reports/databases**
Product Information
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Table of Contents
EXECUTIVE SUMMARY
1 INTRODUCTION
Methodology
Assumptions
Report Organization
2 SEMICONDUCTOR PACKAGING
Industry Market Trends
Regional and Market Issues
Materials Needs – Customer Input
End-market Applications
3 SUBSTRATES
Laminate Substrates
Build-up Substrates
Organic Substrates
Markets and Forecasts Supply
4 LEADFRAMES
Technology Trends
Markets and Forecasts
Supply
5 BONDING WIRE
Technology Trends
Markets and Forecasts
Supply
6 Encapsulation Materials
Technology Trends
Markets and Forecasts
Supply
7 UNDERFILL MATERIALS
Technology Trends
Markets and Forecasts
Supply
8 DIE ATTACH MATERIALS
Technology Trends
Markets and Forecasts
Supply
9 WAFER LEVEL PACKAGE DIELECTRICS
Technology Trends
Markets and Forecasts
Supply
10 WAFER LEVEL PLATING CHEMICALS
Requirements
Markets and Forecasts
Supply
11 SUMMARY AND CONCLUSIONS
APPENDICES
In-person interview with material suppliers, packaging subcontractors and semiconductor manufacturers around the world are the sources of information for this study. Market size information is developed through primary research and modeling. Five-year market forecasts are developed based on different scenarios of new technology penetration and market growth.
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