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Publication Date:

Principal Analysts:

SEMI and E. Jan Vardaman of TechSearch Inc.

Format:

Microsoft® Excel® file (.xls)
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1Q24 Worldwide Assembly & Test Facility Database
Overview
Methodology
Overview

This database is a comprehensive data file that tracks over 670 back-end facilities of IDMs (Integrated Device Manufacturers) and outsourced semiconductor assembly and testing (OSAT) manufacturers globally. This database provides access to and insights into global assembly & test facilities in China, Taiwan, Korea, Japan, Southeast Asia, Europe, and the Americas. The report highlights packaging technology offerings by manufacturing location. 

The database includes details such as: 

  • Plant Site technology capability, including Wafer Sort, Final Test, Tape and Reel
  • Packaging assembly service offered, such as BGA, Leadframe packages (like QFP, QFN, SO), and Advanced packaging offerings, defined as flip chip bumping and assembly, fan-out and fan-in wafer level packaging (WLP), through silicon via (TSV), 2.5D and 3D capability.
  • New in the 2024 edition: Advanced packaging offerings and Automotive certification status. 

**Multi-user and Enterprise licenses must be purchased when more than 1 user accesses SEMI reports/databases**

Key Highlights

To stay up to date with advances in packaging technology that impact chip performance, reliability, and cost, it's important to understand the offerings of companies in different locations. The updated report includes key features such as:

  • More than 150 new facilities compared to the 2022 report.
  • The world's top 20 OSAT companies in 2022 with financial comparison to 2021. Preliminary comparisons to 2023 are also provided and will be updated after the reporting cycle is complete. 
  • More than 200 companies and over 670 total back-end facilities.
  • More than 325 facilities with test capabilities.
  • More than 100 facilities offering QFN.
  • More than 85 bumping facilities, including more than 65 with 300mm wafer bumping capacity.
  • More than 90 facilities offering WLCSP technology.
  • More than 130 OSAT facilities in Taiwan, more than 150 in China, and more than 60 in Southeast Asia.
  • More than 50 IDM A&T facilities in Southeast Asia, about 45 in China, nearly 20 in Americas and more than 12 in Europe.
  • More than 30% of global factories offer advanced packaging capabilities in one of the following areas: flip chip bumping and assembly, fan-out and fan-in wafer level packaging (WLP), through silicon via (TSV), 2.5D and 3D.

 

Product Information 

Features

  • Manufacturing site information
  • Packaging technology capabilities
  • Plant site applications capabilities
  • Type of services offered
  • Manufacturing specialization by facility 

Benefits

  • Gain insight into worldwide IDM assembly/test and OSAT facilities capabilities and expertise.
  • Understand key packaging capabilities and technologies by IDM and OSAT.
  • A tool to identify new business opportunities and assess competition.
  • Empower your market research with verified, validated, and credible information.
Methodology

The source of information for this study is based on both primary and secondary research. The primary research includes in-person interviews and surveys with industry contacts from over 100 OSAT facilities worldwide.

Purchase

Product Member Non-Member  
Worldwide Assembly & Test Facility Database - 1 user, One Time Purchase $7,850 $10,500 Buy Now

To purchase multiple user licenses at a discount, please contact mktstats@semi.org.

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