Foamtec International
Feb 24, 2022
1141770
About Foamtec International WCC:
• Foamtec International's mission is to enable contamination control professionals to improve particle control in clean rooms by solving surface contamination challenges
The advent of sub 40nm nodes and 3D memory processes in wafer Fabs have required ever tighter contamination control measures in order to maintain acceptable yields.
• Equipment engineers are struggling to implement high precision PMs in order to reduce defects and improve tool availability
• Process engineers and EH&S require reductions in VOC’s
• Particles are major contributors to scratch defect, backside contamination and “hot spot” issues and lead to significant reductions in yield, reliability, and fab productivity
• 200 and 300 mm fabs often resort to using expensive test wafers as gettering wafers in order qualify tools after wet cleans
Foamtec, has pioneered innovative UltraSOLV ScrubPADS and MiraWIPEs that have enabled dramatic improvements in wet clean procedures and step change reductions in particle levels on wafer processing tools. Foamtec’s Hi Vac qualified abrasives and wipers are production proven on process chambers, end stations, electrostatic chucks (ESC) and wafer transfer robotics to reduce particle defects, test wafer usage, hazardous solvents, and tool downtime.
The Foamtec International Sales/Application Engineering Staff has worked closely with the leading Tool Manufacturers and Equipment Engineers, to develop High Precision PM Procedures that drive improved tool performance and reduced cost of ownership. We have a worldwide network of factory trained equipment engineers to help our customers upgrade vacuum chamber PM procedures.
• Foamtec International's mission is to enable contamination control professionals to improve particle control in clean rooms by solving surface contamination challenges
The advent of sub 40nm nodes and 3D memory processes in wafer Fabs have required ever tighter contamination control measures in order to maintain acceptable yields.
• Equipment engineers are struggling to implement high precision PMs in order to reduce defects and improve tool availability
• Process engineers and EH&S require reductions in VOC’s
• Particles are major contributors to scratch defect, backside contamination and “hot spot” issues and lead to significant reductions in yield, reliability, and fab productivity
• 200 and 300 mm fabs often resort to using expensive test wafers as gettering wafers in order qualify tools after wet cleans
Foamtec, has pioneered innovative UltraSOLV ScrubPADS and MiraWIPEs that have enabled dramatic improvements in wet clean procedures and step change reductions in particle levels on wafer processing tools. Foamtec’s Hi Vac qualified abrasives and wipers are production proven on process chambers, end stations, electrostatic chucks (ESC) and wafer transfer robotics to reduce particle defects, test wafer usage, hazardous solvents, and tool downtime.
The Foamtec International Sales/Application Engineering Staff has worked closely with the leading Tool Manufacturers and Equipment Engineers, to develop High Precision PM Procedures that drive improved tool performance and reduced cost of ownership. We have a worldwide network of factory trained equipment engineers to help our customers upgrade vacuum chamber PM procedures.
Primary Industry
Semiconductor
Primary Product Category
Fab Infrastructure and Services
Primary Product Sub Category
Other
Website
720 Venture Drive
Waco
TX
76712